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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/91518


    Title: 12寸晶圓線切割關鍵參數及品質優化之人工智能模組研發-12寸晶圓線切割關鍵參數及品質優化之人工智能模組研發( I );Research and Development of Artificial Intelligence Module for Key Parameters and Quality Optimization of 12-Inch Wafer Wire Slicing (Da)( I )
    Authors: 李朱育;林志光;陳志臣;鍾雲吉
    Contributors: 國立中央大學機械工程學系
    Keywords: 晶柱切割;線切割;晶圓品質量測;線切割模型模擬;減振及吸振;人工智慧;即時監測及控制;Crystal Pillar Slicing;Wire Saw;Wafer Quality Measurement;Wire-Saw Model Simulation;Vibration Damping and Vibration Absorption;Artificial Intelligence;Real-Time Monitoring and Control.
    Date: 2024-01-26
    Issue Date: 2024-09-18 14:58:40 (UTC+8)
    Publisher: 科技部
    Abstract: 晶圓切割是晶圓製程的關鍵步驟,晶圓切割產業也具有極大商機。本計畫將開發一套快速分析切割晶圓之重要參數量測及品質預測模組,可協助台灣指標廠商建立高效率智慧化的晶圓線切割技術與機台,可望為其增加15%的產能,爭取龐大商機,協助台灣廠商保有晶圓切割產業的領先地位。本計畫研究內容包含光學量測技術、流場物理、機械振動物理、人工智慧、機器學習等,可培育智慧機械之系統整合人材,所開發的技術也可外溢,協助國內中小企業跨入智慧製造。
    Relation: 財團法人國家實驗研究院科技政策研究與資訊中心
    Appears in Collections:[Departmant of Mechanical Engineering ] Research Project

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