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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/91998


    Title: 藍寶石薄基板圓通孔和啞鈴形通孔之超快脈 衝雷射微鑽孔研究;Study on Ultrashort Pulsed Laser Micro-drilling of Circular and Dumbell-shaped Vias in Thin Sapphire Substrate
    Authors: 鄭亦宸;Zheng, Yi-Chen
    Contributors: 光機電工程研究所
    Keywords: 藍寶石鑽孔;飛秒雷射;六軸平台;Sapphire drilling;femtosecond laser;Six axis platform
    Date: 2023-08-17
    Issue Date: 2023-10-04 14:52:32 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 本研究探討藍寶石薄基板使用超快脈衝雷射進行圓通孔和啞鈴形
    通孔的微鑽孔技術。由於其高熱傳導性和優異的光學特性,藍寶石薄基板在
    光電子學、光學器件和生物醫學等領域具有廣泛應用前景。然而,藍寶石材
    料的硬脆、難加工特性,傳統的機械鑽孔技術在 100 微米孔徑以下的微鑽
    孔上已面臨瓶頸。為了克服傳統鑽孔技術的限制,本研究提出了一種基於超
    快脈衝雷射的微鑽孔方法。本研究使用飛秒雷射搭配六軸移動平台的物鏡
    加工系統進行研究,利用飛秒雷射產生高能量密度的光束在藍寶石薄基板
    上進行微鑽孔,六軸移動平台可以改變平台角度以調整雷射的入射角度。通
    過優化的飛秒雷射參數設定,本研究成功地實現了在藍寶石薄基板上形成
    圓通孔和啞鈴形通孔。本研究分析不同的雷射參數對鑽孔品質的影響,包括
    平滑的孔壁、無裂紋和最小錐度等,最後透過實驗調整出適當的參數組合並
    實現高品質的圓通孔和啞鈴形通孔。;This study investigates the micro-drilling technique of circular through-holes
    and dumbbell-shaped through-holes on sapphire thin substrates using an ultrafast
    pulsed laser. Due to its high thermal conductivity and exceptional optical
    properties, sapphire thin substrates hold extensive potential applications in
    photonics, optical devices, and biomedical fields. However, the inherent hardness
    and difficulty in processing sapphire material have posed challenges for
    traditional mechanical drilling techniques, particularly for micro-drilling with
    hole diameters below 100 micrometers. To overcome the limitations of
    conventional drilling methods, this study proposes a micro-drilling approach
    based on the ultrafast pulsed laser. The study employs a femtosecond laser in
    conjunction with a six-axis motion platform and objective lens system for research
    purposes. The femtosecond laser generates a high-energy density beam on the
    sapphire thin substrate to perform micro-drilling, while the six-axis motion
    platform allows for adjustment of the laser′s incident angle by changing the
    platform′s orientation. Through optimization of the femtosecond laser parameters,
    this study successfully achieves circular through-holes and dumbbell-shaped
    through-holes on the sapphire thin substrate. The research analyzes the impact of
    different laser parameters on drilling quality, including factors such as smooth
    hole walls, absence of cracks, and minimal tapering. Finally, through
    experimental adjustments, an appropriate parameter combination is determined,
    resulting in the realization of high-quality circular through-holes and dumbbellshaped through-holes.
    Appears in Collections:[光機電工程研究所 ] 博碩士論文

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