藍寶石薄基板圓通孔和啞鈴形通孔之超快脈 衝雷射微鑽孔研究;Study on Ultrashort Pulsed Laser Micro-drilling of Circular and Dumbell-shaped Vias in Thin Sapphire Substrate

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题名:	藍寶石薄基板圓通孔和啞鈴形通孔之超快脈衝雷射微鑽孔研究;Study on Ultrashort Pulsed Laser Micro-drilling of Circular and Dumbell-shaped Vias in Thin Sapphire Substrate
作者:	鄭亦宸;Zheng, Yi-Chen
贡献者:	光機電工程研究所
关键词:	藍寶石鑽孔;飛秒雷射;六軸平台;Sapphire drilling;femtosecond laser;Six axis platform
日期:	2023-08-17
上传时间:	2024-09-19 15:46:37 (UTC+8)
出版者:	國立中央大學
摘要:	本研究探討藍寶石薄基板使用超快脈衝雷射進行圓通孔和啞鈴形通孔的微鑽孔技術。由於其高熱傳導性和優異的光學特性，藍寶石薄基板在光電子學、光學器件和生物醫學等領域具有廣泛應用前景。然而，藍寶石材料的硬脆、難加工特性，傳統的機械鑽孔技術在 100 微米孔徑以下的微鑽孔上已面臨瓶頸。為了克服傳統鑽孔技術的限制，本研究提出了一種基於超快脈衝雷射的微鑽孔方法。本研究使用飛秒雷射搭配六軸移動平台的物鏡加工系統進行研究，利用飛秒雷射產生高能量密度的光束在藍寶石薄基板上進行微鑽孔，六軸移動平台可以改變平台角度以調整雷射的入射角度。通過優化的飛秒雷射參數設定，本研究成功地實現了在藍寶石薄基板上形成圓通孔和啞鈴形通孔。本研究分析不同的雷射參數對鑽孔品質的影響，包括平滑的孔壁、無裂紋和最小錐度等，最後透過實驗調整出適當的參數組合並實現高品質的圓通孔和啞鈴形通孔。;This study investigates the micro-drilling technique of circular through-holes and dumbbell-shaped through-holes on sapphire thin substrates using an ultrafast pulsed laser. Due to its high thermal conductivity and exceptional optical properties, sapphire thin substrates hold extensive potential applications in photonics, optical devices, and biomedical fields. However, the inherent hardness and difficulty in processing sapphire material have posed challenges for traditional mechanical drilling techniques, particularly for micro-drilling with hole diameters below 100 micrometers. To overcome the limitations of conventional drilling methods, this study proposes a micro-drilling approach based on the ultrafast pulsed laser. The study employs a femtosecond laser in conjunction with a six-axis motion platform and objective lens system for research purposes. The femtosecond laser generates a high-energy density beam on the sapphire thin substrate to perform micro-drilling, while the six-axis motion platform allows for adjustment of the laser′s incident angle by changing the platform′s orientation. Through optimization of the femtosecond laser parameters, this study successfully achieves circular through-holes and dumbbell-shaped through-holes on the sapphire thin substrate. The research analyzes the impact of different laser parameters on drilling quality, including factors such as smooth hole walls, absence of cracks, and minimal tapering. Finally, through experimental adjustments, an appropriate parameter combination is determined, resulting in the realization of high-quality circular through-holes and dumbbellshaped through-holes.
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