台灣的印刷電路板產業推出了SMT製程技術來應付目前市場所需要的高度精細的小體積電子產品需求，但是目前要使用SMT製程技術仍需花費許多人力及時間在操作設備及資料傳輸上面，為此SEMI國際半導體產業協會提出了SMT-ELS A1/A1.1通訊協議，希望可以透過SMT自動解決上述問題。 本研究的目標是實作出SMT-ELS A1/A1.1通訊協議的實體材料交握通訊，但是在實體材料交握通訊過程中，訊號及狀態組合種類繁多，難以快速的建立出正確的系統架構，為此本研究採用MIAT方法論來設計系統架構，基於SMT-ELS A1/A1.1通訊協議內容所制定的流程及狀態，去建立系統的IDEF0功能模組，接著在對每個功能模組依照通訊規範進行離散事件建模，建立Grafcet模型，最後再做軟體高階合成。軟體驗證的部份則是會依據通訊協議的正常交握流程及異常處理流程，確認各項訊號變化及狀態轉移是否符合規範。 ;The printed circuit board industry in Taiwan has introduced Surface Mount Technology (SMT) process to meet the growing demand for highly precise and compact electronic products in the current market. However, using SMT process still requires a significant amount of manpower and time for equipment operation and data transmission. To address this issue, SEMI International, the semiconductor industry association, has proposed the SMT-ELS A1/A1.1 communication protocol, aiming to automate the aforementioned challenges through SMT. The objective of this study is to implement the Material Handoff Handshake of the SMT-ELS A1/A1.1 communication protocol. However, in the process of Material Handoff Handshake, there are numerous signal and state combinations, making it challenging to quickly establish the correct system architecture. Therefore, this study adopts the MIAT methodology to design the system architecture. Based on the processes and states specified in the SMT-ELS A1/A1.1 communication protocol, the IDEF0 functional modules of the system are developed. Subsequently, each functional module is discretely event modeled according to the communication specifications, establishing a Grafcet model. Finally, software high-level synthesis is performed. In terms of software validation, it involves confirming whether the signal variations and state transitions comply with the protocol, based on the normal handshaking process and abnormal handling process of the communication protocol.
