半導體晶圓的生產流程步驟複雜繁多，以及近期第三世代半導體材料氮化鎵(GaN)的興起，工廠為了因應新世代的來臨，陸續地導入了許多新型機台。然而在關鍵製程的生產機台站點，使用量測機台來確認晶圓，於生產製程前、生產製程後的數值變化，方能即時確認該站的製程情況，並且同時提高產品的品質。 廠內在導入一台新型量測機台時，前置作業包含許多環節，例如機台設備與自動化程式的通訊連線狀況、自動化程式所發送命令是否被機台接受並且機台收到命令後執行對應之動作，以及最後自動化程式上拋至伺服器端的量測結果的量測值、格式是否為製程工程師所需等事宜。 前述所列之前置作業，對於工廠內的管理層來說，將會把自動化程式的開發時程與其規劃至同一時程表當中。因此，本論文將設計一套量測機台之自動化程式，針對來自不同設備供應商的量測機台，且透過軟體工程手法，解析機台作業流程與命令訊息格式和內容，並將自動化程式的功能封裝模組化，提供給後續引進新型量測機台對應之自動化程式作為使用，以及同時保留程式修改擴充的彈性。 ;The process of semiconductor wafers is complicated with many processes, and GaN, a third-generation material, is on the rise in the near future. In response to the advent of new material generation, the company has introduced many new equipment. Measurement equipment is used to ensure the wafer’s quality at critical process. Through pre-measure and post-measure, the process status can be confirmed in real-time. When introducing a new measurement equipment into factory, the pre-processing involves many things, such as checking the connection between the program and the equipment, and the commands are accepted and executed properly by the equipment, and the format and content of the data uploaded to server by the program is in accordance with the processing engineer’s requirements. The pervious operations listed above will be planned in the same schedule as the development of the program for management in factory. Therefore, in this paper, we will design the program architecture for different equipment suppliers’ measurement equipment, and analyze the operation flow and command message format and content through software engineering, and functionalize and modularize the program to provide the program for subsequent introduction of new measurement equipment, as well as retain the flexibility of program.
