| 摘要: | IC載板，是印刷電路板 (Printed Circuit Board, PCB) 的一種應用，相較PCB更輕，體積也更小，是一種專門用來承載IC用的電路板，同時可固定、保護並支撐IC晶片。IC載板的重要性在於它承載了許多關鍵的電子元件，這些元件組成了現代電子設備的核心。總的來說，IC載板在現代電子產品中的重要性無法忽視，它是確保電子設備功能正常運行的關鍵組件之一。
本研究運用經濟學的「結構—行為—績效」 (Structure-Conduct-Performance, S-C-P) 架構理論，透過S-C-P分析IC載板產業基本條件、政府政策、從市場結構、廠商行為、產業績效五個面向來看IC載板產業目前的狀況與未來的發展。
在基本條件方面，IC載板的直接原料仍須仰賴日本，但取得難度並不高，其次在產品研發上，所需要投入人力與費用相當大，只有具備規模的大廠有能力投入。政府政策方面，有關IC載板產業的相關國家的政府政策主要為一般性政策、投資誘因、管制與法規三項，臺灣、中國、美國與日、韓等國也都提出相對應的法規。
市場結構方面，研究發現，IC載板產業是「低度寡占」的「競爭I型」市場，但是以實際的狀況來說，通常被視為競爭激烈的市場。廠商行為方面，IC載板產業已向半導體產業靠攏，是一個資本密集、技術密集的產業。大廠擁有龐大的資源，充足的人力，可以在新產品開發的前期就與客戶合作，取得新產品的門票。其次IC載板產業進入門檻很高，當廠商想要保持競爭優勢時，確實需要不斷創新並擴大規模。最後在產業績效方面，可以看到IC載板產業獲利率優於傳統印刷電路板產業，算是一個獲利較好的產業，但是仍低於其他半導體的產業。研究出結果為廠商獲利情形與產品類型相關，由於AI與高速運算的需求，ABF載板是IC載板產業成長與獲利的動能。
本研究提出以下五點建議，以供對此產業有興趣者參考。持續投資研發和創新、提升產品品質和可靠性、優化供應鏈管理、推關注新興應用領域、加強環保意識和實踐，來提升產業競爭力。;IC Substrate is an application of Printed Circuit Board (PCB), which is lighter and smaller than PCB, and is a circuit board specially designed to carry ICs, while fixing, protecting and supporting IC chips. The importance of the IC substrate lies in the fact that it carries many key electronic components that form the core of modern electronic devices. Overall, the importance of IC substrates in modern electronics cannot be ignored, and it is one of the key components to ensure the proper functioning of electronic devices.
This study uses the "Structure-Conduct-Performance" (S-C-P) architecture theory of economics to analyze the basic conditions of the IC substrate industry, government policies, and the current status and future development of the IC substrate industry from five aspects: market structure, manufacturer behavior, and industrial performance.
In terms of basic conditions, the direct raw materials of IC substrates still have to rely on Japan, but it is not difficult to obtain, and secondly, in product research and development, the manpower and cost required are quite large, and only large manufacturers with scale have the ability to invest. In terms of government policies, the government policies of countries related to the IC substrate industry are mainly general policies, investment incentives, and regulations and regulations, and Taiwan, China, the United States, Japan, South Korea and other countries have also proposed corresponding regulations.
In terms of market structure, the study found that the IC substrate industry is a "competitive Type I" market with "low oligopoly", but in practice, it is generally regarded as a highly competitive market. In terms of manufacturer behavior, the IC substrate industry has moved closer to the semiconductor industry, which is a capital-intensive and technology-intensive industry. Large manufacturers have huge resources and sufficient manpower, and can cooperate with customers in the early stage of new product development to obtain tickets for new products. Secondly, the IC substrate industry has a high barrier to entry, and when manufacturers want to maintain a competitive advantage, they really need to continue to innovate and expand their scale. Finally, in terms of industrial performance, it can be seen that the profit margin of the IC substrate industry is better than that of the traditional printed circuit board industry, which is a profitable industry, but it is still lower than that of other semiconductor industries. The results show that the profitability of manufacturers is related to the type of product, and due to the demand for AI and high-speed computing, ABF substrates are the driving force for the growth and profitability of the IC substrate industry.
This study proposes the following five recommendations for those interested in this industry. We will continue to invest in R&D and innovation, improve product quality and reliability, optimize supply chain management, focus on emerging application areas, and strengthen environmental awareness and practices to enhance the competitiveness of the industry. |
