微細片狀電極結合超音波輔助電化學放電加工於石英玻璃加工微槽之研究;Investigation of Ultrasonic-Assisted Electrochemical Discharge Machining for Quartz Micro-slot by Using Micro-sheet Electrode

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Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/96009

Title:	微細片狀電極結合超音波輔助電化學放電加工於石英玻璃加工微槽之研究;Investigation of Ultrasonic-Assisted Electrochemical Discharge Machining for Quartz Micro-slot by Using Micro-sheet Electrode
Authors:	陳俊樺;Chen, Jun-Hua
Contributors:	機械工程學系
Keywords:	精密電化學放電加工;石英;微槽加工;界面活性劑;超音波研磨;荷重元回饋;有限元素分析
Date:	2024-08-23
Issue Date:	2024-10-09 17:30:13 (UTC+8)
Publisher:	國立中央大學
Abstract:	本研究利用電化學放電加工 (Electrochemical Discharge Machining, ECDM)結合超音波振動輔助，於石英玻璃進行通槽加工，使用階段式片狀碳化鎢工具電極，工件為厚度 0.3 mm 之石英玻璃，進行加工特性之研究，探討參數包含工作電壓、界面活性劑濃度變化、超音波輸出功率、進給速度等加工參數對加工品質之影響，第一階段加工 UA-ECDM 搭配自製之荷重元感知回饋控制系統，於加工時自動調整進給速度，防止工件之材料移除速度較工具電極進給速度緩慢而導致破裂之現象，UA-ECDM 加工通槽後，維持相同的加工配置下，直接進行第二階段 UVAG 加工，免除更換刀具與避免定位精度破壞之問題，持續進給精密移動平台，加入鑽石研磨液，並藉由超音波之高頻振動，使磨料持續對工件進行研磨，透過超音波研磨針對第一階段電化學放電後之通槽進行破邊修整，完成第二階段加工，最後觀察入、出口尺寸、出口破邊量之情形及加工後之電極消耗。採用超音波振動輔助進行微槽加工，藉由超音波高頻振動使電解液產生壓力產生變化，此壓力變化會形成泵吸作用，並對電解液產生擾動之效果，加速排除加工區之反應熱及各種加工產物，藉此改善電解液隨加工深度變深而循環效率降低之現象；另外，加入界面活性劑可提升工具電極表面潤濕性，有助於改善加工效率，由實驗結果得知，界面活性劑有助於提升加工深度，超音波振動輔助能夠減少蝕刻影響區，結合兩者輔助媒介之優勢進行通槽，並藉由進給速度的調變改善通槽出口處破片之情形，最後進行超音波研磨實現入口長寬分別為 0.459 mm、3.063 mm，出口長寬分別為 0.446 mm、 3.064 mm 之微槽尺寸，電極消耗率為 0.776 %。 ;This study employs Electrochemical Discharge Machining (ECDM) combined with ultrasonic vibration assistance, using a stepped, flat tungsten carbide tool electrode to machine through-slots in 0.3 mm thick quartz glass. The research investigates the effects of various machining parameters on machining quality, including working voltage, concentration of surfactant, ultrasonic output power level, and feed rate. In the first stage, the UA-ECDM, equipped with a self-made load cell feedback control system, automatically adjusts the feed rate during machining to prevent cracks caused by the material removal rate of the workpiece being slower than the feed rate of the tool electrode. After machining the through-slot with UA-ECDM, the second stage involves UVAG machining using the same setup to avoid tool change and maintain positioning accuracy. This stage continues the feed on a precision moving platform, introducing diamond abrasive slurry, and employs high-frequency ultrasonic vibration to continuously grind the workpiece. Ultrasonic grinding is used to deburr the through-slot edges formed in the first stage of electrochemical discharge, completing the second stage of machining. Finally, the study observes the inlet and outlet dimensions, the amount of outlet burrs, and the electrical discharge consumption after machining. The use of ultrasonic vibration-assisted micro-groove machining utilizes high frequency ultrasonic vibrations to cause pressure changes in the electrolyte, which creates a pumping effect and disturbs the electrolyte. This disturbance accelerates the removal of reaction heat and various machining by-products from the machining area, thereby improving the efficiency of electrolyte circulation as the IV machining depth increases. Additionally, adding surfactants enhances the wettability of the tool electrode surface, contributing to improved machining efficiency. Experimental results show that surfactants help increase machining depth, and ultrasonic vibration assistance can reduce the affected area of etching. By combining the advantages of both auxiliary media, it is possible to machine through-grooves and improve the fragmentation at the groove exit by adjusting the feed rate. Finally, ultrasonic grinding achieved micro-groove dimensions of 0.459mm * 3.063mm at the inlet and 0.446mm * 3.064mm at the outlet, with an electrode wear rate of 0.776%.
Appears in Collections:	[Graduate Institute of Mechanical Engineering] Electronic Thesis & Dissertation

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