隨著科技迅速發展及電子產品需求的持續增長，半導體行業正面臨越來越激烈的市場競爭。選擇合適的供應商不僅對企業的生產效率有顯著影響，還直接關係到整體供應鏈的穩定性與可靠性。導線架在半導體封裝中擔任關鍵角色，其材料特性對於封裝性能和生產效率至關重要。因此，建立一套科學且合理的供應商評選標準，無論從實用層面還是理論意義上看，都顯得尤為重要。本研究將針對半導體封測產業中的導線架供應商選擇進行深入探討。 本研究結合專家訪談和文獻分析，運用層級分析法（Analytic Hierarchy Process，AHP）建立評選標準體系。層級分析法將複雜決策問題劃分為多層結構，幫助理解各因素之間的關聯。研究中，專家訪談結果與文獻分析相結合，形成多層次評選框架，以全面評估導線架供應商的能力。 研究結果顯示，成本、品質和交貨能力是供應商選擇中最為關鍵的三項因素，這三者合計權重超過70%。這一結果反映了在半導體封測行業中，企業在選擇供應商時，對於成本控制的重視程度以及對產品質量的嚴格要求。 在選擇供應商的過程中，企業不應僅僅關注傳統的價格和質量指標，還需納入生產技術及服務質量等多重因素。建立一套完善的多維評選標準能夠協助企業在挑選供應商時進行更全面的分析與考量。未來的研究可進一步探討該評選框架在不同類型供應商中的應用，尤其是在市場需求迅速變化的背景下，企業需提升反應速度與適應能力，以增強其競爭優勢。 ;The rapid advancement of technology and the persistent growth in demand for electronic products have led to increasingly fierce competition within the semiconductor industry. The selection of appropriate suppliers significantly influences production efficiency and directly affects the stability and reliability of the overall supply chain. Within semiconductor packaging, the wire bond plays a critical role, and the material properties of this component are essential for both packaging performance and production efficiency. Therefore, establishing a scientific and rational set of supplier selection criteria is crucial, both from a practical standpoint and a theoretical perspective. This study aims to conduct an in-depth exploration of the selection of wire bond suppliers in the semiconductor packaging industry. Using expert interviews and literature analysis, this research employs the Analytic Hierarchy Process (AHP) to develop a structured evaluation criteria system. AHP facilitates the breakdown of complex decision-making problems into a multi-layered framework, aiding in the understanding of the relationships between various factors. By synthesizing the results of expert interviews with literature findings, the study creates a comprehensive multi-level evaluation framework to thoroughly assess the capabilities of wire bond suppliers. The findings indicate that cost, quality, and delivery capability are the three most critical factors in supplier selection, collectively accounting for over 70% of the total weighting. This outcome underscores the importance that companies in the semiconductor packaging sector place on cost control and their stringent requirements for product quality when selecting suppliers. In the supplier selection process, it is essential for companies to consider more than just traditional metrics such as price and quality; they must also incorporate multiple factors such as production technology and service quality. Developing a comprehensive, multidimensional evaluation standard will enable firms to conduct a more thorough analysis and consideration when choosing suppliers. Future research could further investigate the application of this evaluation framework across different types of suppliers, especially in the context of rapidly changing market demands, where companies must enhance their responsiveness and adaptability to strengthen their competitive advantage.
