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    Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/97353


    Title: 利用深共熔溶劑與二氧化矽奈米粒子的 3D列印可穿戴式應變感測器;3D-Printed Wearable Strain Sensors Utilizing Deep Eutectic Solvents and Fumed Silica Nanoparticles
    Authors: 何欣蓓;Ho, Hsin-Pei
    Contributors: 化學工程與材料工程學系
    Keywords: 共熔凝膠;深共熔溶劑;二氧化矽奈米顆粒;3D列印墨水;應變感測器;eutectogel;deep eutectic solvent;fumed silica nanoparticle;3D printing ink;strain sensor
    Date: 2025-06-19
    Issue Date: 2025-10-17 11:10:39 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 共熔凝膠(Eutectogels)近年來廣泛應用於柔性應變感測器,但其作為可列印墨水並進一步轉化為功能性感測器的應用仍相對有限。本研究開發了一種具備列印性能的凝膠系統,藉由將二氧化矽奈米粒子均勻分散於由氯化膽鹼與丙烯酸組成的深共熔溶劑(DES)中,形成具剪切變稀特性的溶膠。當二氧化矽濃度超過臨界值時,溶膠會轉變為物理凝膠,展現出適合直接墨水書寫的流變特性。值得一提的是,整體配方中未添加任何化學交聯劑。在光引發劑的作用下,經紫外光固化後,物理凝膠可轉變為化學交聯網絡,形成機械性與導電性皆可調控的共熔凝膠。固化後的材料透明、柔軟且具導電性,適合應用於具應變回應功能的感測裝置。經 3D 列印製備的感測器能穩定貼附於皮膚表面,在受力變形時產生穩定且可重複的電阻變化,展現其於穿戴式電子與人體動作監測領域的應用潛力。;Eutectogels are widely explored for flexible strain sensing applications; however, their use as printable inks that can be transformed into functional sensors has been limited. In this study, a printable gel system was developed by incorporating fumed silica nanoparticles into a deep eutectic solvent composed of choline chloride and acrylic acid. The well-dispersed mixture formed a shear-thinning sol that transitioned into a physical gel beyond a critical silica concentration, exhibiting rheological properties suitable for direct ink writing. Notably, no chemical crosslinker was added in the formulation. Upon UV curing in the presence of a photoinitiator, the physical gel was converted into a chemically crosslinked network, forming an eutectogel with tailored mechanical and electrical characteristics. The cured structures were transparent, flexible, and conductive, showing strong potential for use in strain-responsive applications. The printed sensors adhered well to the skin and generated consistent electrical signals under deformation, supporting their applicability in wearable electronics and motion monitoring platforms.
    Appears in Collections:[化學工程與材料工程研究所] 博碩士論文

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