含銦中溫銲料微結構與介金屬化合物成長動力學之探討

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > Electronic Thesis & Dissertation > Item 987654321/97605

Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/97605

Title:	含銦中溫銲料微結構與介金屬化合物成長動力學之探討
Authors:	龍紫萱;Lung, Tzu-Hsuan
Contributors:	化學工程與材料工程學系
Keywords:	中溫銲料
Date:	2025-08-26
Issue Date:	2025-10-17 11:40:37 (UTC+8)
Publisher:	國立中央大學
Abstract:	在先進構裝製程中，銲料常透過迴焊程序將晶片載板與基板連接，以確保穩定的機械接合與良好的訊號傳輸效能。傳統構裝普遍採用Sn-Pb共晶銲料，主因其具有低熔點、良好機械性能、高潤濕性與低成本等優勢。然而，隨著全球環保法規日趨嚴格，無鉛銲料逐漸取代Sn-Pb，成為主流趨勢。其中SAC305合金因具備良好機械強度與延展性而被廣泛應用，但其相對較高的熔點不僅增加製程能耗，也提升製造成本。為改善SAC305銲料的熱性質與可靠性，文獻指出可透過添加Bi與In元素進行成分優化。Bi的加入可提升拉伸與剪切強度並降低熔點，但同時可能犧牲部分延展性；而In則可進一步降低熔點並抑制介金屬化合物的成長，有助於提升銲點之長期穩定性與機械強度。本研究以Sn-Ag-Cu-Bi-In銲料為對象，系統性探討不同In含量對其熱性質、IMC成長行為及破斷模式的影響。首先，分別將Sn-Ag-Cu-Bi-6In與Sn-Ag-Cu-Bi-12In銲料封管後置於135 °C與125 °C下進行5、10、15與30天之高溫儲存測試，藉由EPMA與XRD觀察In含量對銲料內部相組成與IMC演化的影響。此外，將Sn-3.5Ag-0.8Cu-0.5Bi-6In與傳統SAC305銲料迴焊於OSP/Cu基板上，進行150 °C下250、500與1000小時之固/固相界面反應測試，進一步分析In與Bi對Cu6(Sn, In)5與Cu3(Sn, In)等界面IMC層成長速率的抑制效應。最後，透過推力測試與破斷面分析，探討高溫儲存後兩種銲料之破斷模式與機械強度變化。實驗結果顯示，In的添加可有效降低銲料熔點，並生成Ag9In4相。此外，Sn-Ag-Cu-Bi-6In銲料於界面反應中所形成的IMC層厚度成長速率明顯低於SAC305，顯示In與Bi可延緩IMC過度生成。推力測試結果則指出，兩種銲料皆以延性破壞為主，儘管高溫儲存後皆出現劣化傾向，但Sn-Ag-Cu-Bi-6In銲料之剪切強度整體仍高於SAC305。綜合分析，Bi的固溶強化作用與In對IMC微結構細化及分佈均勻性的改善，為提升整體機械性能與熱穩定性之主因，證實Sn-Ag-Cu-Bi-6In焊料為一具潛力之中溫高可靠度無鉛銲料系統。 ;In advanced electronic packaging, lead-free solders are increasingly favored due to environmental regulations. However, traditional SAC305 solders have relatively high melting points, limiting their use in low-temperature applications. To improve solder reliability and reduce processing temperatures, this study investigates Sn-Ag-Cu-Bi-In alloys with varying indium content, focusing on their thermal properties, interfacial reactions, and mechanical performance. The results of this work showed that the addition of indium effectively lowered the solder′s melting point and led to the formation of the Ag9In4 phase. Sn-3.5Ag-0.8Cu-0.5Bi-6In and SAC305 were reflowed on OSP/Cu substrates and subjected to high temperature storage at 150 °C for 250, 500, and 1000 hours. Growth kinetics analysis showed that Sn-Ag-Cu-Bi-6In formed thinner Cu6(Sn, In)5and Cu3(Sn, In) layers than the corresponding IMCs in SAC305, indicating that In and Bi additions help suppress IMC overgrowth. Shear tests and fracture analysis confirmed that both alloys primarily failed through ductile fracture. Despite some degradation after aging, Sn-Ag-Cu-Bi-6In maintained higher shear strength than SAC305, attributed to In-induced IMC refinement and Bi’s solid solution strengthening. These findings demonstrate that Sn-Ag-Cu-Bi-6In offers superior mechanical stability and thermal reliability, making it a strong candidate for advanced medium-temperature, lead-free soldering applications.
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] Electronic Thesis & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	0	View/Open

社群 sharing

Loading...