奈米纖維素添加於錫鉍基底銲料對 微結構與機械性質之影響

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Title:	奈米纖維素添加於錫鉍基底銲料對微結構與機械性質之影響
Authors:	林子馨;Lin, Tzu-Hsin
Contributors:	化學工程與材料工程學系
Keywords:	低溫銲料
Date:	2025-08-26
Issue Date:	2025-10-17 11:40:46 (UTC+8)
Publisher:	國立中央大學
Abstract:	隨著電子產品朝向高效能、輕薄短小與異質整合發展，構裝技術面臨更嚴峻的熱管理與可靠度挑戰。傳統高溫焊接製程所造成的翹曲現象成為導致元件失效與構裝良率下降的主因，為降低構裝中的熱應力累積並提升可靠度，開發低溫無鉛銲料成為關鍵。Sn-58Bi合金是電子產業中廣泛應用的低溫銲料之一，然而其中的Bi元素具脆性，容易造成銲點可靠度下降，進而限制其應用範圍。本研究透過摻雜奈米纖維素(Cellulose Nanofibers, CNFs)，探討其對Sn-58Bi與Sn-56.8Bi-1Ag-0.2Cu低溫銲料之微結構與機械性質影響。本研究首先透過不同CNFs添加比例對SnBi銲料微結構的細化效果與剪切應力變化，選出最佳比例後應用於SnBiAgCu銲料中，驗證其在多元合金中的適用性。研究方法透過SEM、DSC、XRD、EPMA與推力測試，分析CNFs在銲料中的分布與強化機制。結果顯示CNFs有助於細化SnBi與SnBiAgCu銲料微結構並提升銲點的機械性質，雖對熔點與凝固起始溫度無明顯影響，但能提高凝固完成溫度，縮短凝固時間，促進相均勻分佈，在XRD分析中未發現新相生成，顯示CNFs不與銲料中的元素反應。本研究進一步透過高溫儲存測試評估銲點在長期高溫環境下的可靠度，結果顯示，添加CNFs可有效抑制微結構粗化，並經由推力測試驗證CNFs的添加可提升銲點的長期可靠度。 ;Low-temperature lead-free solders such as Sn–58Bi are attractive for advanced packaging but suffer from Bi-induced brittleness. This study evaluates cellulose nanofibers (CNFs) as micro-alloying additives in Sn–58Bi and Sn–56.8Bi–1Ag–0.2Cu (SnBiAgCu). Microstructure, melting/solidification, and reliability were characterized by SEM/EPMA, XRD (full and fine scans), DSC, and ball-shear testing, with High-Temperature Storage (HTS) at 75/100/125 °C for 5–30 days. The optimal content is 0.02 wt.% CNFs. In SnBi it halves the eutectic interphase spacing and increases shear strength by ~80%; applied to SnBiAgCu it further reduces spacing by ~20% and raises strength by ~17%. DSC shows nearly unchanged melting Tonset but higher solidification peak/end temperatures indicating shortened late-stage solidification. XRD reveals no new phases, while fine-scan peaks shift left, consistent with slight lattice expansion. EPMA maps place carbon mainly in the Bi-rich phase. Under 125 °C/30 days, CNFs suppress coarsening and retain higher shear strengths.
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] Electronic Thesis & Dissertation

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