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    請使用永久網址來引用或連結此文件: https://ir.lib.ncu.edu.tw/handle/987654321/97710


    題名: SiC/Al複合材料對導熱與機械性質最佳化製程之研究;Study on the Optimization Process of Thermal Conductivity and Mechanical Properties of SiC/Al Composite Materials
    作者: 謝偉俊;Hsieh, Wei-Chun
    貢獻者: 材料科學與工程研究所
    關鍵詞: SiC預形體;直交表;田口法;最佳化;貢獻度;SiC preform;orthogonal array;Taguchi method;optimization;contribution ratio
    日期: 2025-08-01
    上傳時間: 2025-10-17 11:49:05 (UTC+8)
    出版者: 國立中央大學
    摘要: 本研究採用體積百分比64 %之SiC預形體,透過壓力滲透法製備SiC/Al複合材料,藉由顯微結構觀察、密度與硬度測量,以及電性與熱傳分析試驗,結合田口法設計L9直交表探討鋁液種類、鋁液溫度與滲透壓力三項品質因子對複合材料品質特性之影響,並系統性評估各因子對材料特性之貢獻度。
    結果顯示,滲透壓力(2、4、6 atm)為影響材料性能之最重要的因子,可有效提升鋁液滲透效率與複合材料之緻密性,對密度、硬度與導電度的貢獻度分別為84.9 %、81.0 %、84.3 %;對密度、硬度與導電度之S/N比,三者貢獻度分別為85.3 %、80.2 %、88.5 %;鋁液種類(Al、Al-3Si、Al-6Si) 為次要因子,鋁中Si含量增加有助於改善鋁液潤濕性與滲透效率,提升結構緻密性,對密度、硬度與導電度的貢獻度分別為11.0 %、17.7 %、8.4 %;對密度、硬度與導電度之S/N比,三者貢獻度分別為11.2 %、18.0 %、9.5 %;相較之下,鋁液溫度(900、975、1050 °C)為影響最小之因子。在確認試驗中,實測值與預測結果高度吻合,驗證田口法之準確性,且比較最佳製程條件(Al-6Si、1050 °C、6 atm)與參考條件(Al、900 °C、2 atm)所製得之材料性質,顯示密度、硬度、導電度分別提升4.9 %、51.9 %、32.8 %,而其S/N比亦分別提升4.7 %、10.3 %與15.2 %。此外,導熱率提升至132.688 W/m·K,較參考條件提升約35.2 %,顯示提升材料結構緻密性有助於改善其熱與電傳導性能。
    ;This study fabricated SiC/Al composites using a pressure infiltration method with a 64 vol% SiC preform. The quality characteristics of the composites were evaluated through microstructure observation, density and hardness measurements, and electrical and thermal conductivity analyses. The Taguchi method with an L9 orthogonal array was employed to investigate the influence of three quality factors – aluminum alloy type, aluminum alloy temperature, and infiltration pressure – on the composite quality characteristics, and to systematically evaluate the contribution of each factor to the material properties.
    The results indicated that infiltration pressure (2, 4, 6 atm) was the most significant factor influencing material performance, effectively enhancing the infiltration efficiency of molten aluminum and the densification of the composites. Its contributions to density, hardness, and conductivity were 11.0%, 17.7%, and 8.4%, and to their S/N ratios were 11.2%, 18.0%, and 9.5%, respectively. The aluminum alloy type (Al, Al–3Si, Al–6Si) was a secondary factor. Higher Si content improved wettability and infiltration, enhancing densification. Its contributions to density, hardness, and conductivity were 11.0 %, 17.7 %, and 8.4 %, and to their S/N ratios were 11.2 %, 18.0 %, and 9.5%, respectively. In contrast, melt temperature (900, 975, 1050 °C) had the least influence among the factors. In the confirmation test, the measured values closely matched the predicted results, validating the accuracy of the Taguchi method. When comparing the optimized process parameters (Al-6Si, 1050 °C, 6 atm) with the reference condition (Al, 900 °C, 2 atm), the resulting material properties showed improvements in density, hardness, and electrical conductivity by 4.9 %, 51.9 %, and 32.8 %, respectively. Similarly, the S/N ratios increased by 4.7 %, 10.3 %, and 15.2 %. In addition, the thermal conductivity was improved to 132.688 W/m·K, representing a 35.2 % increase compared to the reference condition. These results demonstrate that improving the structural densification of the composite is beneficial for enhancing both thermal and electrical conductivity.
    顯示於類別:[材料科學與工程研究所 ] 博碩士論文

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