積體電路載板產業分析

NCUIR > School of Management at National Central University > Executive MBA > Electronic Thesis & Dissertation > Item 987654321/98030

Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/98030

Title:	積體電路載板產業分析
Authors:	羅元良;LO, YUAN-LIANG
Contributors:	高階主管企管碩士班
Keywords:	IC載板;ABF載板;BT載板;先進技術封裝;產業分析;IC substrate;ABF substrate;BT substrate;advanced technology packaging;industry analysis
Date:	2025-06-18
Issue Date:	2025-10-17 12:16:12 (UTC+8)
Publisher:	國立中央大學
Abstract:	本論文參考產業經濟學中廣泛應用的「結構—行為—績效（Structure-Conduct-Performance, S-C-P）」模型，分析載板產業，探討基本條件、市場結構與政府政策。在基本條件方面，載板的核心原材料如樹脂基板與銅箔，供應端市場高度集中，載板廠商在議價上處於相對弱勢。隨著Flip Chip封裝與ABF材料等技術的突破，載板的線路密度與微縮能力顯著提升，得以支援AI、高效能運算等高階應用的需求。台灣載板三雄，在全球市場中占據領先地位，憑藉技術創新與資本投入維持競爭力。然而，面對產能與市場需求的快速變動，載板廠商需具備靈活的經營策略以因應變局。政策層面上，台灣政府透過租稅減免、補助及技術研發支持，積極推動載板產業升級。各國對環境保護與勞動條件的法規也日趨嚴格，廠商在全球化布局時，必須同時遵循國際規範，才能確保長遠營運的穩定性與合法性。從市場結構角度來看，載板產業整體呈現「競爭型到低度寡占的市場」特性，特別是在台灣，載板三雄主導市場。也由於載板產業涉及高資本與技術門檻，客戶認證程序嚴格，加上既有企業築起競爭壁壘，使得新進者進入市場的難度極高，特別是在高階載板領域，技術與資本的高要求進一步提高了進入門檻難度。在廠商行為方面，載板廠商持續投入技術研發，以應對市場變化。同時，在訂價策略上，也需兼顧成本控制與風險管理。此外，面對競爭壓力與產能需求變動，透過併購整合、擴廠與自動化投資，來提升規模效益與產出效率。深化海外佈局、強化供應鏈彈性，也成為企業維持全球競爭力的關鍵手段。未來的競爭不僅來自技術優勢，更取決於能否快速回應市場變化、建構靈活經營模式並推動永續轉型。政府、產業與學研單位亦應攜手合作，形成完善的創新生態系，為台灣在全球半導體產業鏈中持續保有關鍵地位提供堅實後盾。 ;This study adopts the widely used Structure–Conduct–Performance (S-C-P) model from industrial economics to analyze the IC substrate industry, focusing on basic conditions, market structure, and government policy. In terms of basic conditions, the core raw materials for substrates, such as resin-based laminates and copper foil, are highly concentrated on the supply side, placing substrate manufacturers at a relative disadvantage in price negotiations. With breakthroughs in technologies such as Flip Chip packaging and ABF materials, substrate line density and miniaturization capabilities have improved significantly, enabling support for advanced applications like AI and high-performance computing. Taiwan′s three leading substrate manufacturers hold a dominant position in the global market, maintaining competitiveness through continuous innovation and capital investment. However, given the rapid shifts in capacity and market demand, companies must adopt flexible business strategies to remain resilient. On the policy front, the Taiwanese government has actively promoted the upgrading of the substrate industry through tax incentives, subsidies, and support for R&D initiatives. At the same time, environmental and labor regulations have become increasingly stringent worldwide. Therefore, firms must comply with international standards when expanding globally to ensure sustainable and lawful long-term operations. From the market structure perspective, the substrate industry generally ranges from competitive to moderately oligopolistic, especially in Taiwan where the "three substrate giants" dominate the market. Due to high capital intensity, technological barriers, and rigorous customer certification processes, existing firms have established strong competitive moats. These factors make it extremely difficult for new entrants to penetrate the market, particularly in the high-end substrate segment where technical and financial demands are even more stringent. Regarding firm behavior, substrate companies continue to invest in technology R&D to respond to market changes. Pricing strategies must strike a balance between cost control and risk management. In the face of competitive pressure and fluctuating capacity demands, firms pursue mergers and acquisitions, capacity expansion, and automation investments to enhance economies of scale and production efficiency. In addition, global expansion and strengthening supply chain resilience have become critical strategies to maintain international competitiveness. In the future competitiveness will not rely solely on technological superiority, but also on a company′s ability to swiftly respond to market shifts, build agile business models, and drive sustainable transformation. Government, industry, and academia must collaborate to establish a comprehensive innovation ecosystem that provides a strong foundation for Taiwan to maintain its critical position in the global semiconductor supply chain.
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