| 摘要: | 半導體封裝與測試產業，作為現代電子構裝技術的基石，近年來經歷了顯著的轉型，半導體封測廠的地位已經不再是過往，業界認定的傳統製造業。
COVID-19 大流行引發了全球供應鏈的一系列震盪，對半導體封測造成了極大運作壓力。隨著各行各業對半導體的需求激增，尤其是在車用電子和 AI 應用領域，對更快、更高效的生產與測試過程的需求變得更加迫切。車用電子應用，隨著對半導體元件的依賴增加，如先進駕駛輔助系統（ADAS）系統，及 AI 技術，這些技術對於高效能晶片的需求尤為強烈，用於機器學習、數據處理及自主運作等任務，成為推動半導體封裝和測試服務需求的重要驅動力。這一趨勢加速了測試和封裝方法創新的推動，以應對日益增長的市場需求。
疫情的關鍵結果之一是對其有限的封測產能競爭加劇。隨著半導體製造商爭相滿足不斷上升的需求，封裝和測試設施面臨著現有產能無法滿足市場需求的情況。這一現象被稱為「產能擠壓」，導致了半導體封裝和測試行業的戰略轉變。為應對這一需求增長，企業被迫重新考慮其營運策略，許多企業選擇擴建現有工廠或將生產轉移至新地點以提升產能。然而，這些變化也帶來了重大的挑戰，因為遷移至新設施/地點或擴建現有設施需要大量投資，並且需要一定的時間去驗證新技術和新流程。
除了產能擠壓，半導體設計公司的合併和收購進一步複雜化了情況，被併購的設計公司於封裝測試廠既有的位置也可能隨行調整。
而封測廠彼此的併購，使得供應鏈的整合更加順暢，產能更有彈性的調配，有助於生產流程的優化。然而，它們也增加了管理產品驗證過程的複雜性。隨著設計公司與封裝/測試設施的融合，傳統的單一或少數測試合作夥伴的合作模式變得不再常見。越來越多的IC設計公司選擇多元化合作夥伴關係，以減少過度依賴單一供應商所帶來的風險。這種脫離保守且長期合作的模式，對半導體封裝和測試產業提出了更高的靈活性需求，強調了快速調整生產能力及在不同設施之間靈活移動產品的能力。
本研究還突顯了市場動態如何推動這些變化。隨著車用電子和 AI 領域需求的增長，各類半導體的需求不斷增加，設計公司發現其現有的合作夥伴關係已無法充分滿足需求。因此，許多公司開始尋找新的封裝和測試夥伴，以更好地應對日益複雜且動態的市場需求。這一策略轉變強調了封裝和測試公司在運營中必須具備更高的敏捷性和適應性。快速擴張、搬遷甚至迅速調整規模的能力，成為公司在迅速發展的產業中保持競爭優勢的關鍵。
本研究結論指出，半導體封裝與測試產業正處於一個深刻變革的時期，COVID-19 大流行作為這一轉型的催化劑。車用電子和 AI 技術的引入，加上產能擠壓和供應鏈中併購的興起，催生了該產業對更大靈活性和反應能力的需求。隨著半導體市場的不斷增長和多樣化，封裝和測試公司擴展產能及適應新技術的能力將是滿足未來需求的關鍵。本研究有助於深入理解影響半導體封裝與測試中新產品驗證時程優化的關鍵因素，特別是市場動態和戰略夥伴關係在塑造產業演進中的作用。
;The semiconductor packaging and testing industry, as a cornerstone of modern electronics assembly technology, has undergone significant transformation in recent years. The position of semiconductor packaging and testing facilities is no longer the same as it was in the past, as the industry has shifted from being considered a traditional packaging manufacturing sector.
The COVID-19 pandemic triggered a series of disruptions in the global supply chain, placing immense pressure on semiconductor packaging and testing facilities. As demand for semiconductors surged in various industries, particularly in automotive electronics and AI applications, the need for faster and more efficient production and testing processes became increasingly urgent. Automotive electronics applications, with their growing reliance on semiconductor components for systems like Advanced Driver Assistance Systems (ADAS), and AI technologies, which require high-performance chips for tasks like machine learning, data processing, and autonomous operations, became major drivers of the demand for semiconductor packaging and testing services. This trend accelerated the push for innovation in testing and packaging methods to meet the growing market requirements.
One key outcome of the pandemic was the intensification of competition for limited testing and packaging capacity. As semiconductor manufacturers scrambled to meet the rising demand, packaging and testing facilities faced the situation where their existing capacity could no longer meet market needs. This phenomenon, known as "capacity squeezing," led to a strategic shift in the semiconductor packaging and testing sector. In response to this increased demand, companies were forced to reconsider their operational strategies, with many opting to expand their existing plants or move operations to new locations to enhance capacity. However, these changes also brought significant challenges, as relocating to new facilities or expanding existing ones required substantial investment and adaptation to new technologies and processes.
In addition to the capacity squeeze, mergers and acquisitions of semiconductor design companies further complicated the situation. The acquired design companies could also adjust their positions at the packaging and testing plants. The mergers between packaging and testing facilities helped streamline the supply chain integration, allowing for more flexible capacity allocation and optimizing production processes. However, they also increased the complexity of managing product verification processes. As design houses and packaging/testing facilities became more integrated, the traditional model of working with a single or few testing partners became less common. More and more IC design companies chose to diversify their partnerships to reduce the risks associated with over-reliance on any single supplier. This shift away from conservative, long-standing cooperation models has raised the need for greater flexibility in the semiconductor packaging and testing industry, emphasizing the ability to rapidly adjust production capacities and move products between different facilities as needed.
This research also highlights how market dynamics have driven these shifts. With the growth in demand from automotive electronics and AI sectors, the need for various types of semiconductors has risen, prompting design companies to realize that their existing partnerships were no longer sufficient. Consequently, many companies began to seek new packaging and testing partners to better meet the increasingly complex and dynamic market demands. This strategic shift underscores the necessity for packaging and testing companies to be more agile and adaptable in their operations. The ability to quickly expand, relocate, or scale operations has become a competitive advantage as companies strive to stay ahead in a rapidly evolving industry.
This study concludes that the semiconductor packaging and testing industry is undergoing a profound transformation, with the COVID-19 pandemic serving as a catalyst for this shift. The introduction of automotive and AI technologies, combined with the capacity squeeze and the rise of mergers and acquisitions within the supply chain, has created a demand for greater flexibility and responsiveness in the industry. As the semiconductor market continues to grow and diversify, the ability of packaging and testing companies to expand capacity and adapt to new technologies will be critical in meeting future demands. This research contributes to a deeper understanding of the key factors influencing the acceleration of new product verification in semiconductor packaging and testing, with a particular focus on the role of market dynamics and strategic partnerships in shaping industry evolution. |
