| 摘要: | 目前於石英晶圓上製作微形方孔亟具挑戰性，因其具有硬脆之材料特性，傳統切削加工易導致石英晶圓破裂，嚴重影響加工品質，本研究主要係利用電化學放電複合超音波振動輔助啄鑽式電泳沉積加工石英晶圓微形方孔，實驗中選用碳化鎢棒作為工具電極材料，並透過線放電研磨加工(Wire Electrical Discharge Grinding, WEDG)製備成具斜錐面構造之二階式工具電極，於石英晶圓上進行電化學放電加工微形方孔。為進一步改善加工後孔洞之形貌與尺寸精度，後續採用啄鑽式進給方式，進行超音波振動輔助電泳沉積磨料修整技術沿原加工路徑進行加工，藉以提升微形方孔之尺寸精度與形貌。本研究於實驗中，藉由調整各項加工參數進行單因子參數實驗，並探討各項電泳沉積磨料修整加工參數如工作電壓、磨料濃度、進給速度及超音波功率等級對於石英晶圓微形方孔加工之各種品質特性的影響，品質特性包含微形方孔之入、出口邊長平均值、入、出口差、表面形貌、破片情形及二階式工具電極之寬度消耗等。
採用電化學放電複合超音波振動輔助啄鑽式電泳沉積加工石英晶圓微形方孔時，於啄鑽式進給方式下，能有效更新加工區域內之電泳液，增加進入加工區域之碳化矽粉末，提升研磨效果，獲得較佳之微形方孔表面形貌與尺寸精度，實驗結果顯示，利用超音波振動輔助啄鑽式電泳沉積磨料修整加工，進行石英晶圓的微形方孔加工時，於工作電壓1.5 V、磨料濃度9 wt.%、第二階段進給速度1/5 μm/sec及超音波功率等級Level 6為本研究較佳參數組合，並可得到微形方孔加工後之入口邊長平均值為91.66 μm，微形方孔之出口邊長平均值為89.83 μm，且微形方孔之表面形貌與尺寸精度較佳。
;Currently, creating micro square holes in quartz wafers is challenging due to the hardness and brittleness of quartz. Traditional milling can easily lead to wafer fracture, severely affecting processing quality. This study combined electrochemical discharge with ultrasonic vibration-assisted electrophoresis deposition pecking machining to process micro square holes on quartz wafers. Tungsten carbide rods were selected as the tool electrode material; a two-stage tool electrode with a tapered surface structure was fabricated through Wire Electrical Discharge Grinding (WEDG). A pecking feed method was employed in the subsequent ultrasonic vibration-assisted electrophoresis deposition abrasive finishing process to improve the morphology and dimensional accuracy of the machined holes, along the original machining path. This aimed to enhance the quality and dimensional precision of the micro square holes. This study conducted single-factor parameter experiments by adjusting various processing parameters to investigate the effects of working voltage, electrophoresis concentration, feeding rate, and ultrasonic power level on the quality characteristics from micro square hole machining. These characteristics include hole average width, inlet and outlet differences, surface morphology, fragmentation, and electrode width consumption.
When electrochemical discharge with ultrasonic vibration-assisted electrophoresis deposition pecking machining was used, the pecking feed method effectively renewed the electrolyte in the machining area. It increased the amount of silicon carbide particles entering the machining zone, improving the grinding effect. Thus, better surface morphology and dimensional precision of micro square holes were achieved. The experimental results show that the optimal parameter combination was working voltage 1.5 V, electrophoresis concentration 9 wt.%, feeding rate 1/5 μm/sec, and ultrasonic power Level 6. The resulting hole average inlet width was 91.66 μm; the hole average outlet width was 89.83 μm, with improved surface morphology and dimensional precision of micro square holes. |
