| 摘要: | 目前常被用於石英晶圓切割加工之方式主要為半導體微影製程與傳統機械加工等，於傳統機械加工中，由於石英之高硬度與脆性，使加工過程中易產生微裂紋甚至破片，而若採用半導體微影製程進行加工，其加工成本昂貴，且化學蝕刻產生之廢液處理複雜，存在環境汙染之問題。本研究採用直徑150 m之碳化鎢螺旋工具電極，進行磁場輔助電極公轉繞圓電化學放電切割加工石英晶圓之研究，以單因子參數實驗方式進行，探討各項加工參數如工作電壓、脈衝週期、Z軸進給速率及衝擊係數，對石英晶圓之各種加工品質特性之影響，其中加工品質特性包含槽寬、槽深、槽道表面形貌及螺旋工具電極表面形貌，並於各項單因子參數實驗結束後，選用較為適當之參數，進行石英晶圓直徑8 mm之整圓切穿測試，以獲得較佳之加工參數組合。
透過磁場輔助方式，進行電極公轉繞圓電化學放電切割加工石英晶圓之研究，藉由磁場輔助方式產生勞倫茲力作用，促進電解液之更新與絕緣氣膜之薄化，進而提升電極公轉繞圓電化學放電切割加工石英晶圓之加工能力與加工效率。於各項參數實驗及整圓切穿測試結果，可得到本研究較適合之參數組合為工作電壓50 V、脈衝週期10 s、Z軸進給速率1/3 m/s及衝擊係數60 %，相較於前學者之電極公轉繞圓電化學放電切割加工石英晶圓研究結果，於相似之切槽損失下，整圓切穿加工時間減少了10 %。;Standard processing methods for cutting quartz wafers include semiconductor lithography and traditional machining. However, due to the high hardness and brittleness of quartz, traditional machining often results in the formation of microcracks or even fractures. Moreover, using semiconductor lithography for processing involves high costs, and chemical etching generates complex waste that requires specialized liquid treatment, posing concerns surrounding environmental pollution. This study used a tungsten carbide spiral electrode with a diameter of 150 µm as the electrode tool to study quartz wafer cutting using electrochemical discharge machining with a circumferentially arranged electrode
revolution under magnetic field assistance. Single-factor parameter experiments were conducted to investigate the effects of various processing parameters,including voltage, pulse period, Z-axis feed rate, and duty factor, on various
processing quality characteristics of quartz wafers. These characteristics include slot width, slot depth, channel surface morphology, and spiral tool electrode surface morphology. The experimental results indicate that the most suitable parameters were selected to test a full-circle cut through with a diameter of 8 mm on quartz wafers, thereby obtaining the optimal processing parameters.
Introducing magnetic field assistance to induce a Lorentz force promotes electrolyte renewal and thins the gas film. Using electrochemical discharge machining with a circumferentially arranged electrode revolution enhanced the
machining capability and efficiency of quartz wafer cutting. Based on the results from the parameter experiments and full-circle cut through tests, the optimal processing parameters were identified as voltage 50 V, pulse period 10 μs, Z-axis feed rate 1/3 μm/s, and duty factor 60%. Compared to previous studies on quartz wafer cutting using electrochemical discharge machining with circumferentially
arranged electrode revolution, the optimized parameters in this study achieved a 10% reduction in wafer full-circle cut time under comparable slot width conditions. |
