| 摘要: | 現今電子產品早已成為人類日常生活中不可或缺的一部份，晶圓作為積體電路的基板，所有電子產品裡的芯片都是由晶圓製作而成，由於晶圓製造成本昂貴且易碎，因此搬運晶圓的機械手臂強度相當重要，機械手臂容易在結構最弱的關節處因為剛度不足引發共振，進而影響手臂取放動作的穩定性，為滿足高精度、低噪音、方便維護的需求晶圓機械手臂多採用皮帶傳動系統作為關節驅動。就整體剛性而言，較高的皮帶剛性在機械手臂運作時越不容易達到共振，因此本研究針對皮帶傳動系統進行靜剛性值有限元與實驗比對量化分析，然而皮帶靜剛性的指標為扭轉剛性，透過逐步計算又可以分為皮帶齒與皮帶輪嚙合時的接觸剛性與跨距段的拉伸剛性。
本研究之目的為進行晶圓傳遞機械手臂中皮帶傳動系統之靜剛性分析與實驗驗證，首先進行皮帶的幾何關係基本理論、皮帶材料性質實驗與超彈性材料模型理論及數位影像相關法原理介紹，並根據合作公司所提供的皮帶及皮帶輪模型進行FEA (Finite Element Analysis)，分析出二、三維皮帶傳動系統的扭轉剛性、接觸剛性、拉伸剛性，建立實驗平台量測皮帶傳動系統在不同皮帶長度及齒形，以數位影像相關法(Digital Image Correlation, DIC)量測皮帶齒部法向位移量，並且使用數位照相機拍攝主動輪扭轉，透過撰寫Matlab程式量測主動輪扭轉角，計算出搬運晶圓的機械手臂受外力時皮帶靜剛性並將實驗量測結果與FEA分析結果進行比對，進而驗證FEA模型的合理性。
;Nowadays, electronic products have become indispensable in human daily life. Wafers, which serve as substrates for integrated circuits, are fundamental for producing chips used in all electronic devices. Due to their high manufacturing cost and fragility, wafer-handling robotic arms require robust structural strength. Robotic arms are particularly susceptible to resonance at structurally weak joints due to insufficient stiffness, negatively impacting the stability of wafer handling operations. To meet the demands for high precision, low noise, and ease of maintenance, belt-driven systems are commonly employed in wafer-handling robotic arms as joint actuators. Considering overall rigidity, higher belt stiffness reduces the likelihood of resonance during robotic arm operations. Therefore, this research conducts a comparative quantitative analysis of static stiffness values of belt-driven systems using finite element analysis (FEA) and experimental methods. The static stiffness indicator for belts, termed torsional stiffness, can be further subdivided into contact stiffness during belt-to-pulley engagement and tensile stiffness across the belt span.
The objective of this study is to analyze and experimentally validate the static stiffness of the belt-driven system in wafer-handling robotic arms. Initially, the study introduces fundamental theories of belt geometric relationships, experimental determination of belt material properties, hyperelastic material modeling, and digital image correlation (DIC) methods. Finite Element Analysis (FEA) is then conducted based on the belt and pulley models provided by a collaborating company, computing torsional stiffness, contact stiffness, and tensile stiffness for two-dimensional and three-dimensional belt-drive systems. An experimental platform is established to measure the normal displacement of belt teeth using Digital Image Correlation (DIC) under various belt lengths and tooth profiles, while a monocular camera records the torsional deformation of the driving pulley. Matlab programs are developed to quantify the pulley’s torsional angle, enabling the calculation of belt static stiffness under external forces during wafer handling. Finally, experimental results are compared with FEA outcomes to validate the reliability and accuracy of the finite element model. |
