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    Please use this identifier to cite or link to this item: https://ir.lib.ncu.edu.tw/handle/987654321/99488


    Title: 冷媒 R-1233zd(E) 與 R-245fa 於微多孔表面微流道蒸發器之流動沸騰性能研究
    Authors: 陳俊宏;Chen, Jun-Hong
    Contributors: 機械工程學系
    Keywords: 流動沸騰;微流道蒸發器;R-245fa;R-1233zd(E);微多孔表面;Flow boiling;Microchannel evaporator;R-245fa;R-1233zd(E);Microporous surface
    Date: 2026-01-30
    Issue Date: 2026-03-06 19:07:16 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 隨著高功率半導體與電子設備之快速發展,元件發熱密度持續提升,使高熱通量散熱成為當前極需解決之課題。本研究以微流道熱交換器為研究對象,比較低全球暖化潛勢冷媒R-1233zd(E)與傳統冷媒R-245fa於不同表面型式下之流動沸騰熱傳與壓降特性。實驗中以直線型微流道測試段,分別採用平滑表面與微多孔塗層表面進行測試,其中多孔塗層以鋁粉與銅粉噴塗方式製作。實驗於固定飽和溫度條件下,改變質通量與熱通量,量測流動沸騰熱傳係數與流動壓降。
    實驗結果顯示,在兩種冷媒之流動沸騰熱傳整體趨勢相似,在低乾度區域,R-245fa之熱傳係數略高於R-1233zd(E)約15%,主要是由於其液體導熱係數較高,隨著乾度的提高,兩種冷媒的性能趨於一致;而在壓降方面,由於黏滯性的影響,R-1233zd(E)的壓降值始終略低於HFC-245fa約15%,顯示其具備作為低GWP替代冷媒之應用潛力。
    加入微多孔塗層後,兩種冷媒之熱傳性能皆明顯提升,同時壓降隨著增加。而在銅粉與鋁粉為多孔層的比較,由於皆能增加成核孔洞,所以整體熱傳及壓降非常相似,顯示微多孔層之熱傳增強效果主要取決於其成核孔洞,而材料差異對整體性能之影響相對不顯著。;With the rapid advancement of high-power semiconductors and electronic devices, the heat generation density of components continues to increase, making high-heat-flux dissipation a critical challenge that urgently requires a solution. This study investigates microchannel heat exchangers to compare the flow boiling heat transfer and pressure drop characteristics of the low-Global Warming Potential (GWP) refrigerant R-1233zd(E) and the traditional refrigerant R-245fa across different surface configurations. Experiments were conducted using a straight microchannel test section featuring both smooth surfaces and microporous coated surfaces, the latter fabricated via spray coating using aluminum and copper powders. The tests were performed under a fixed saturation temperature while varying mass flux and heat flux to measure the flow boiling heat transfer coefficients and pressure drops.
    The experimental results indicate that the overall flow boiling heat transfer trends for both refrigerants are similar. In the low vapor quality region, the heat transfer coefficient of R-245fa is approximately 15% higher than that of R-1233zd(E), primarily due to its higher liquid thermal conductivity. However, as vapor quality increases, the performance of the two refrigerants converges. Regarding pressure drop, R-1233zd(E)consistently exhibits values approximately 15% lower than R-245fa due to viscosity differences, demonstrating its potential as a viable low-GWP alternative refrigerant.
    With the application of microporous coatings, the heat transfer performance of both refrigerants improved significantly, accompanied by an increase in pressure drop. Comparing the copper and aluminum powder coatings, both materials effectively increased nucleation sites, resulting in very similar overall heat transfer and pressure drop characteristics. This suggests that the heat transfer enhancement provided by the microporous layer depends primarily on the availability of nucleation sites, while the specific material difference has a relatively insignificant impact on overall performance.
    Appears in Collections:[Graduate Institute of Mechanical Engineering] Electronic Thesis & Dissertation

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