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姓名 莊偉祥(Wei-Xiang Zhuang) 查詢紙本館藏 畢業系所 化學工程與材料工程學系 論文名稱 光亮劑於鍍銀銅粉形貌之機制探討及電性影響
(The effect of the brightener on the morphology of silver-coated copper powder and its electrical properties)相關論文 檔案 [Endnote RIS 格式]
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摘要(中) 銀粉廣泛應用於電子元件中的銀膠。但由於銀粉成本高的緣故，銅粉被研究以用來代替銀粉。然而，銅粉表面很容易在大氣中形成氧化物，而造成電阻率高於銀粉。在這項研究中，我們製備了鍍銀銅粉以改善銅粉表面會氧化的情況。首先，製備銅粉溶液和銀離子溶液並混合在一起以將銀沉積在銅粉表面上。並且，在實驗中控制光亮劑的比例。銅粉一開始的形狀為類球狀顆粒，在經過沒有光亮劑的無電鍍，本論文觀察到較少的多面體鍍銀銅粉顆粒。但在具有光亮劑的條件下我們發現了更多的多面體鍍銀銅粉顆粒。光亮劑的作用是因為光亮劑吸附在銅表面上影響鍍銀銅粉形成多面體結構。然後，我們將鍍銀銅粉配置成鍍銀銅膠，測量鍍銀銅膠的電阻率。透過這個測量，我們發現電阻率會隨著多面體顆粒數量的增加而降低。 摘要(英) Silver powders are widely used in electronic devices by silver paste. Because the cost of the silver powders, copper powders was used to replace the silver powders. However copper powders are very easy to be oxides in atmosphere and the resistivity higher than silver powders. In this study, we prepared silver-coated copper powder to improve. Firstly, copper solution and silver solution were prepared and mixed together to deposit the silver on copper powders. Secondly, the composition of brightener was controlled in this experiment. Originally, copper powders were spherical particles and the results showed that less polyhedral particles were observed after electroless plating without brighteners. But more polyhedral particles were found in the conditions with brighteners. The reason for the effect of brightener that brightener adsorbed on copper surface and then affected its structure. Then, we prepared silver-plated copper powder into paste and measure the resistivity of silver-coated copper paste. Through the measurement, we found that the resistivity decrease as the number of polyhedral particles increase. 關鍵字(中) ★ 無電鍍
★ 銅
★ 銀
★ 光亮劑關鍵字(英) ★ electroless
★ copper
★ sliver
★ brightener論文目次 目錄
中文摘要 I
英文摘要 II
目錄 1
圖目錄 III
表目錄 V
第一章 緒論 1
1.1 研究背景 1
1.2 電子封裝 2
1.3金屬導電膠的演進 3
第二章 文獻回顧 5
2.1 賈凡尼置換反應 5
2.2 界面活性劑 6
2.2.1 陽離子界面活性劑 8
2.2.2 陰離子界面活性劑 8
2.2.3 兩性離子界面活性劑 9
2.2.4 非離子性界面活性劑 9
2.3 光亮劑 10
2.4 研究動機 10
第三章 實驗 11
3.1 實驗藥品及其來源 11
3.2 實驗儀器及設定 11
3.3 實驗步驟與方法 14
第四章 實驗結果與討論 16
4.1實驗方式對鍍銀銅粉結構之影響 16
4.2 光亮劑種類及光亮劑含量對鍍銀銅粉結構之影響 19
4.3 銀離子含量對多面體結構之分析 24
4.3.1 銀離子含量對多面體結構之影響 24
4.3.2 銀離子含量對多面體結構之機制探討 26
4.4多面體數量對導電膠電性之分析 27
4.4.1多面體數量對導電膠電性之影響 27
4.4.2多面體數量對導電膠電性之機制探討 28
4.5光亮劑對多面體數量之機制探討 30
第五章 結論 31
參考文獻 32
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