博碩士論文 109521105 詳細資訊




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姓名 許晉瑄(Chin-Hsuan Hsu)  查詢紙本館藏   畢業系所 電機工程學系
論文名稱 利用石英製程及覆晶技術之100GHz T型貼片天線陣列設計
(Design of 100-GHz T-shaped Patch Antenna Array Using Quartz-Sub and Flip-Chip Technology)
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檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   至系統瀏覽論文 (2027-7-1以後開放)
摘要(中) 本論文提出利用石英製程及覆晶技術之100 GHz T型貼片天線陣列設計。天線陣列由兩層石英基板組成,使用微帶線饋入至C型槽孔,再藉由C型槽孔耦合至輻射貼片產生100 GHz天線輻射模態。採用覆晶方式將兩層石英基板做連結,以達到多層金屬結構需求;使用C型槽孔抵銷電流之特性將背向輻射降低,用以提高天線前後比;使用T型輻射貼片集中電流來提高天線增益。為了縮小初始設計輻射貼片尺寸,在最後分別設計寬度方向及長度方向面積縮小化之天線。寬度方向縮小化天線沿用初始設計,採用挖槽將電流路徑延長達成縮小化;長度方向縮小化天線沿用寬度方向縮小化天線之設計,除了挖槽以外,也在輻射貼片處增加一殘段來延長電流路徑,達成縮小化的目的。
本篇論文中天線的設計使用國家研究院台灣半導體研究中心所提供之石英製程製作。整體天線陣列尺寸為22.5×7.5×0.66 mm3(7.5×2.5×0.22 λ03, λ0為100 GHz的自由空間波長),單一天線元件面積為1.9 mm×1.9 mm。天線陣列量測結果顯示阻抗頻寬13.12%(91.66 GHz-104.53 GHz),在100 GHz時增益為13.84 dBi,天線前後比為15.01 dB;寬度方向縮小化T型貼片天線面積為1.2 mm×1.9 mm模擬之阻抗頻寬14.76%(94.93-110.06 GHz),在100 GHz時增益為7.63 dBi,天線前後比為12.79 dB;長度方向縮小化T型貼片天線面積為1.2 mm×1.5 mm,模擬阻抗頻寬17.16%(94.63-112.39 GHz),在100 GHz時增益為6.02 dBi,天線前後比為14.71 dB。
摘要(英) A design of 100-GHz T-shaped patch antenna array using quartz-sub and flip-chip technology is proposed in the thesis. The proposed antenna array consists of two layers of quartz substrates. Using microstrip feeds into a C-slot, then the C-slot couples the signal into the radiating patch. By using the flip chip, two layers of quartz substrates are combined to achieve multi-layer metal structures. The use of C-slot is to offset the current characteristics for reducing the back radiation and then improving the front-to-back ratio of the antenna. In order to reduce size of the patch, the antenna with reduced dimensions in the horizonal and vertical directions are designed. Design of horizontally reduce-sized antenna, following original design, uses slot to extend the current path length to achieve antenna miniaturization; design of vertically reduce-sized antenna, following previous design with slot, uses additional stub to extend current path to attain more antenna miniaturization.
The proposed antenna array is realized with the quartz process provided by Taiwan Semiconductor Research Center Institute. Overall antenna array size is of 22.5×7.5×0.66 mm (7.5 λ0×2.5 λ0×0.22 λ0 at 100 GHz), and the single antenna element area is of 1.9 mm×1.9 mm. Measured results of antenna array show that the impedance bandwidth is 13.12% (91.66 GHz-104.53 GHz), gain is 13.84 dBi at 100 GHz, and the front-to-back ratio is 15.01 dBi. The horizontal reduce-sized T-shaped patch antenna area is of 1.2 mm×1.9 mm. Simulated results of antenna show that impedance bandwidth is 14.76% (94.93-110.06 GHz), gain is 7.63 dBi at 100 GHz, and the front-to-back ratio is 12.79 dBi; The vertical reduce-sized T-shaped patch antenna area is of 1.9 mm×1.5 mm. Simulated results of antenna show that impedance bandwidth is 17.16% (94.63-112.39 GHz), gain is 6.02 dBi at 100 GHz, and the front-to-back ratio is 14.71 dBi.
關鍵字(中) ★ 覆晶技術
★ 石英製程
★ 貼片天線陣列
★ 太赫茲
關鍵字(英) ★ Flip-Chip
★ Quartz Substrate
★ Patch Antenna Array
★ Terahertz
論文目次 摘要 i
Abstract ii
誌謝 iii
目錄 iv
圖目錄 vii
表目錄 xi
第一章 序論 1
1-1 文獻回顧 1
1-2 研究動機 5
1-3 章節介紹 6
第二章 天線基礎理論與製程環境介紹 7
2-1 簡介 7
2-2 貼片天線概述 8
2-3 天線陣列概述 11
第三章 利用石英製程及覆晶技術之100 GHz T型貼片天線陣列設計與分析 13
3-1 簡介 13
3-2 利用石英製程及覆晶技術之100 GHz T型貼片天線陣列設計 13
3-3 利用石英製程及覆晶技術之100 GHz T型貼片天線陣列設計 21
3-3-1二個天線單元 21
3-3-2四個天線單元 23
3-3-3八個天線單元 25
3-4 模擬與量測 27
3-4-1量測環境介紹 27
3-4-2單一天線 30
3-4-3二個天線單元 37
3-4-4四個天線單元 42
3-4-5八個天線單元 47
第四章 利用石英製程及覆晶技術之100 GHz縮小化T型貼片天線結構與分析 54
4-1簡介 54
4-2寬度方向縮小化T型貼片天線設計 54
4-3寬度方向縮小化T型貼片天線調整機制與參數分析 60
4-3-1 參數cw1對頻寬之影響 60
4-3-2 參數cw2對頻寬之影響 60
4-3-3 參數cl1對頻寬之影響 61
4-4長度方向縮小化T型貼片天線設計 62
4-5長度方向縮小化T型貼片天線調整機制與參數分析 65
4-5-1 參數al1對頻寬之影響 65
4-5-2 參數aw1對頻寬之影響 66
4-6結論 66
第五章 結論 67
參考文獻 68
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指導教授 丘增杰(Tsen-Chieh Chiu) 審核日期 2022-7-29
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