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    显示项目81351-81400 / 83955. (共1680页)
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    日期题名作者
    2013-04-30 電路印刷板產業以平衡計分卡方法之準交率改善研究 李珈育; Lee,Chia-yu
    2020-12-03 電路板拉焊製程參數優化與 烙鐵頭剩餘使用壽命預測之研究;Achieving Optimum Process Parameters and Prediction of Remaining Useful Life of Soldering Tip for Drag Soldering of Printed Circuit Board 陳思羽; Chen, Sz-Yu
    2009-01-06 電路板機構設計與電子設計之資料交換模式探討 鍾添良; Tien-Liang Chung
    2011-07-03 電路板產業存貨改善研究-以N公司為例; Inventory improvement research of PCB industry - By N corporation 張峰銘; Feng-Ming Chang
    2018-07-30 電路板製程電鍍金槽降低金鹽用量之研究;Study on the Electroplating Gold Tanks to Reduce the Amount of Gold Salt in Circuit Board Process 陳建維; Chen, Chien-Wei
    1995-09-01 電路模擬性能提升之研究;Performance Improvement of Circuit Simulation 蔡曜聰
    2009-03-26 電遷移對純錫導線晶粒旋轉之研究; Grain Rotation Induced by Electromigration in Pure Tin Strip 謝育忠; YU-CHUNG HSIEH
    2006-07-01 電遷移對覆晶元件銲點之影響(I); The Effects of Electromigration on Flip-Chip Solder Joints(I) 高振宏
    2005-06-16 電遷移對銅原子在熔融錫鉛銲料中擴散行為之影響; The diffusion of Cu in the molten eutectic Sn-pb solder with electromigration 蘇皇維; Huamg-Wei Su
    2005-06-16 電遷移對銅於液態銲錫中的溶解速率之影響; The dissolution rate of copper in the molten solder with current stressing 黃建融; Chien-Zong Huang
    2006-06-21 電遷移對錫鬚晶生長行為之影響 林育蔚; Yu-Wei Lin
    2008-06-19 電遷移效應對Sn5Ag/Cu界面反應的影響; Current density effect on the interfacial reaction between Sn5Ag/Cu 葉昱廷; Yu-ting Yeh
    2002-06-27 電遷移效應對錫微結構影響之探討; Electromigration effect on the microstructure of Tin foil 王祥文; Hisang-Wen Wang
    2013-06-18 電遷移誘發銅基材於純錫銲料及錫銀銲料中消耗探討 陳佳鈺; Chen,Chia-yu
    2004-06-23 電遷移誘發銅墊層消耗動力學之研究; Study of Cu dissolution induced by Electromigration 戈鈴; Lin Ke
    2010-12-23 電遷移誘發錫/銅界面(錫,銅)原子通量之交互關係及其對錫/銅銲點電遷移失效機制影響研究; Study of interaction between electromigration-induced (Sn,Cu) atomic fluxes at Sn/Cu interface and the effect on EM-induced failure modes at Sn/Cu joint interface 曾華偉; Hua-wei Tseng
    2013-06-18 電遷移誘發錫原子逆迴流通量與錫自身電遷移通量 於陰極銅/錫界面原子通量交互關係之研究; Study of interaction between electromigration-induced Sn back-filled atomic fluxes and Sn EM flux on EM-induced failure modes at Sn/Cu joint interface 呂承澤; Lu,Cheng-Tse
    2023-06-28 電鍍(111)奈米雙晶銅在不同應力模式下的塑性變形機制研究;Plastic deformation mechanism of nano-twinned Cu under different stress model 李稼鴻; Lee, Chia-Hung
    2010-07-28 電鍍法製備準直排列ZnO; 奈米結構陣列及其特性之研究 Fabrication of large-area vertically aligned ZnO nanostructure arrays by electrodeposition and their properties. 葉秉昀; Ping-Yun Yeh
    2019-08-20 電鍍製作銅錫合金及Cu6Sn5之三維奈米晶微結構及其特性研究;Three-dimensional micro features of copper-tin alloy with Cu6Sn5 in Nanocrystals prepared by electroplating and their characterization 林佳政; Lin, Chia-Cheng
    2015-07-16 電鍍製程含硫酸亞錫廢水再利用方法之研究;Investigation of Stannous Sulfate Wastewater Recycling in Electroplating Process 黃尹廷; Huang,Ying-ting
    2007-07-04 電阻串數位類比轉換器之類比多工器設計; Design of Analog Multiplexer in a Resistor-String DAC 陳保霖; Bao-Lin Chen
    2007-07-04 電阻串聯式連續參考值產生器的佈局; Layout of a Resistor-String Successive Reference Generator 莊勝富; Sheng-fu juang
    2015-08-13 電阻串連式連續參考值產生器於製程設計套件之評量;Qualification of the Resistor-String Successive Reference Generator for Process Design Kit 林昭淇; Lin,Chao-Chi
    2016-12-29 電阻性非揮發性靜態隨機存取式記憶體之測試與診斷;Testing and Diagnosis of Memristor-Based Nonvolatile SRAMs 李昱霆; Li, Yu-Ting
    2004-06-28 電阻率剖面與槽溝剖面之對比研究; A comparison study between RIP and trenching results 陳伯毅; Victor Chen
    2021-08-18 電阻率變化與降雨間關係及其對於山崩的影響:以宜蘭太平山蘭台地區為例;Relationships between Variations in Electrical Resistivity and Precipitation and Their Implications for Landslides: Case Study in the Lantai area, Ilan Taiping Mountain, Northeast Taiwan 蔡武男; Tsai, Wu-Nan
    2001-07-10 電離圖判讀與流星研究; Autoscaling Ionogram and Studying Meteor events 顏誠法; Chen-Far Yen
    2008-06-25 電離層1356埃大氣暉光之研究; A study of the ionospheric 135.6nm airglow 許美蘭; Mei-Lan Hsu
    2021-08-05 電離層Es層狀結構的研究–地面雷達與衛星共同觀測 張瀚文; Chang, Han-Wen
    2020-01-13 電離層E域與F域電子與離子密度剖面的模擬;Model Simulations of Ion and Electron Density Profiles in Ionospheric E and F Regions 朱延祥; 蘇清論; 王建亞
    2004-06-03 電離層E層場列不規則體移行速度之估算研究; The drift velocity of E layer FAI at ionosphere 莊理文; Li-wen Chuang
    2003-06-02 電離層E層場沿不規則體地區特性之研究 蔡雯君; Wen-Chun Tsai
    2012-07-23 電離層F2 層臨界頻率(foF2)之自動判讀改進與正確性判別;Automatic Scaling of Critical Frequency of F2 Layer and the Accuracy Testing of Results 張雅莉; Chang,Ya-li
    2014-07-24 電離層中性分子密度變化對太陽活動的響應;Variations of ionospheric neutral densities in response to solar activity 何萬謙; Ho,Wan-chien
    2018-07-10 電離層參數判讀演算法與電離圖實高分析 柯凱鈞; Ke, Kai-Jun
    2012-09-01 電離層地震前兆( I ) 劉正彥; 陳玉英; 蔡和芳
    2012-12-01 電離層地震前兆( I );Seismo-Ionospheric Precursor( I ) 劉正彥; 陳玉英; 蔡和芳
    2015-09-11 電離層地震前兆( IV );Seismo-Ionospheric Precursor (IV) 劉正彥; 蔡和芳; 陳玉英
    2013-12-01 電離層地震前兆(II);Seismo-Ionospheric Precursor (II) 劉正彥; 蔡和芳; 陳玉英
    2014-09-10 電離層地震前兆(III);Seismo-Ionospheric Precursor (III) 劉正彥
    2021-12-21 電離層地震前兆之特徵與其產生機制;Characteristics and Causal Mechanisms in Earthquake Precursors of the Ionospheric Plasma 劉正彥; 林其彥
    2002-05-21 電離層地震前兆之研究; A study of seismo-ionospheric precursor 卓裕榮; Yu-Jung Chuo
    2009-06-26 電離層地震前兆與震源機制; Seismo-Ionospheric Precursor and Focal Mechanisms 蘇泳誌; Yong-Chih Su
    1994-01-01 電離層振動與地磁微脈動之產生機制; The Causal Mechanisms of Ionospheric Oscillations and Geomagnetic Pulsations 劉正彥; 林俊宏
    2007-06-28 電離層探測儀與全球定位系統聯合觀測電離層F層電漿密度不規則體; The Concurrent Observations of the Ionospheric F-region Plasma Density Irregularity Using Ionosonde and Global Positioning System 陳瑋陞; Wei-Sheng Chen
    2013-12-01 電離層擾動發電的理論檢驗;Theoretical Inspection of Ionospheric Disturbance Dynamo 黃健民
    2006-05-19 電離層散塊E層3公尺不規則體凍結效應之研究; A study of Frozen-in property of 3-m plasma Irregularities in Ionospheric Sporadic E layer 鄭倩敏; Chin-Min Tee
    2016-08-31 電離層散塊E層GPS電波掩星觀測之模擬;Simulation of Gps Radio Occultation Measurement of Sporadic E Layer 朱延祥
    2012-07-26 電離層散塊E層不規則體之整合觀測研究;Coordinate observation of ionospheric sporadic E plasma structure 陳承聖; Chen,Cheng-Sheng
    显示项目81351-81400 / 83955. (共1680页)
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    每页显示[10|25|50]项目

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