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顯示項目22651-22700 / 81569. (共1632頁) << < 449 450 451 452 453 454 455 456 457 458 > >> 每頁顯示[10|25|50]項目

日期	題名	作者
1998	Smectic bimetallomesogens: synthesis, characterization and mesomorphic properties and the crystal structure of bis[N-(3-hydroxypropyl)-4-octanoylsalicylaldiminato]copper(II) complex	Lai,CK; Leu,YF
2000	Smectic bimetallomesogens: Synthesis, characterization, and mesomorphic properties of bis[N-(3-hydroxpropyl)-3,4-dialkoxysalicylaldiminato] metal complexes.	Lai,CK; Yang,JD
2011	Smectic Edge Dislocations under Shear	Chen,PL; Lu,CYD
2006	A smooth broadcasting scheme for VBR-encoded hot videos	Yu,Hsiang-Fu; Yang,Hung-Chang; Ho,Pin-Han; Chen,Yi-Ming; Tseng,Li-Ming
2004	Smooth fast broadcasting (SFB) for compressed videos	Yu,HF; Yang,HC; Chen,YM; Tseng,LM; Kuo,CY
2004	A smooth recursive frequency-splitting scheme for broadcasting VBR-encoded hot videos	Yu,HF; Yang,HC; Chen,YM; Tseng,LM
2006	Smooth solutions to a class of quasilinear wave equations	Cheng-Hsiung Hsu,Song-Sun Lin,Tetu Makino
2017-06-28	Smoothing GPS Data for Vehicle Collision Avoidance	阮源翔; Juan, Yuan-Hsiang
2000	Smoothness and periodicity of some matrix decompositions	Chern,JL; Dieci,L
2013-07-29	SMS Guardian: Protect a Smartphone against Incoming SMS Message Interception	陳安琪; Chen,An-chi
2024-06-12	SMT 機聯網 SEMI SMT-ELS A2 水平通訊 軟體開發;Implementation of the Software Based on the Horizontal Communication of SMT-ELS	黃世銘; Huang, Shih-Ming
2023-07-24	SMT-ELS 機聯網垂直通訊應用情境設計與驗證;Implementation of Vertical Communication Application Scenario Design and Verification for SEMI SMT-ELS	曾能翊; Tseng, Neng-I
2023-01-17	SMT-ELS 機聯網通訊協定之垂直通訊的一 般數據軟體設計和實驗;Implementation of Vertical Communication General Data Software for SEMI SMT-ELS	陳思穎; Chen, Shih-Ying
2023-07-24	SMT-ELS-A2機聯網協定材料資料通訊軟體實現;Implementation of Material Data Communication Software for SEMI SMT-ELS-A2	林正儒; Lin, Cheng-Ju
2023-07-24	SMT-ELS機聯網實體材料交握通訊軟體設計與驗證;Implementation of Material Handoff Handshake Software for SEMI SMT-ELS	羅子靖; Luo, Tzu-Ching
2023-07-24	SMT-ELS機聯網水平通訊交握通訊軟體實現;Implementation of the Software Based on the Mode Resolution Handshake of Horizontal Communication of SMT-ELS	游志文; Yu, Chih-Wen
2023-07-22	SMT-ELS機聯網通用數據水平通訊軟體實現;Implementation of General Data Horizontal Communication for SMT-ELS	楊秉儒; Yang, Bing-Ru
2023-01-17	SMT-ELS機聯網通訊協定之橫向通訊的一般數據軟體設計和實作;Implementation of Horizontal Communication General Data Software for SEMI SMT-ELS	高興; Kao, Hsing
2023-01-17	SMT-ELS機聯網通訊協定的平行數據握手軟體實作;Implementation of Horizontal Communication Data Handshake Software for SEMI SMT-ELS	田浩德; Tien, Hao-De
2023-01-17	SMT-ELS機聯網通訊協定的數據握手軟體設計和實作	林致遠; Lin, Zhi-Yuan
2023-01-17	SMT-ELS機聯網通訊協定的材料握手軟體實作;Implementation of Material Handshake Software for SMT-ELS Protocol	張銘仁; Chang, Ming-Jen
2015-06-23	SMT在電子組裝業之發展與應用策略探討-以AA公司為例	羅國平; Lo,Kuo-pin
2017-05-22	SMT料件之目視管理應用—以A公司為研究對象	賴欽建; Lai, Chin-Chien
2024-01-22	SMT機聯網SEMI SMT-ELS A2垂直通訊軟體開發;Implementation of the Software Based on the Vertical Communication of SMT-ELS	錢彥光; Cian, Yan-Guang
2009-06-04	Sn(Cu)焊料與不同NiCo組成合金墊層之介面反應研究; Interfacial reaction between Sn(Cu) solder and NiCo alloy UBM	陳駿維; Chun-Wei Chen
2005-06-30	Sn-3.5Ag-0.5Cu無鉛銲錫受階梯狀負荷之潛變性質; Creep Properties of Sn-3.5Ag-0.5Cu Lead-Free Solder under Step-Loading	鄧軒宇; Hsuan-yu Teng
2000-07-04	Sn-3.5Ag無鉛銲料與BGA墊層反應之研究	劉家明; Jian-Ming Liu
2004-07-12	Sn-3Ag-(0~0.9)Cu銲料迴銲於銅基板後之電化學遷移行為	蘇茂華; Mau-Hwa Su
2007-06-21	Sn-3Ag-0.5Cu-XNi(X=0.0~0.1 wt%)銲料迴銲後機械性質與電化學遷移之探討 ;Mechanical property and Electrochemical Migration of the Sn-3Ag-0.5Cu-XNi(X=0.0~0.1 wt%) Reflowed on Cu-pads in various solution.	彭中南; Chung-nan Peng
2006-07-10	Sn-8Zn-(0~4)Bi中鉍含量對其迴銲於化金基板上後機械性質及電化學遷移之影響	簡宏文; Hung-Wen Chien
2005-06-07	Sn-9Zn-(0~4)Ag迴銲於化金基板後在純水中之電化學遷移行為; Electrochemical Migration of Sn-9Zn-(0~4)Ag Reflowed on Cu/Ni/Au Substrate in Pure Water	洪宜芳; Yi-Fang Hong
2011-08-01	Sn-based無鉛銲料中微量成分(金,銀,銦,銅)之電遷移行為;Electromigration behavior of the additives (Au,Ag,In,Cu) in the Sn-based Pb-free solders	劉正毓
2010-07-01	Sn-based無鉛銲料中微量成分(金,銀,銦,銅)之電遷移行為;Electromigration Behavior of the Additives (Au,Ag,In,Cu) in the Sn-Based Pb-Free Solders	劉正毓
2010-08-01	Sn-based無鉛銲料中微量成分(金、銀、銦、銅)之電遷移行為; Electromigration Behavior of the Additives (Au,Ag,In,Cu) in the Sn-Based Pb-Free Solders	劉正毓
2010-08-01	Sn-based無鉛銲料中微量成分(金、銀、銦、銅)之電遷移行為; Electromigration Behavior of the Additives (Au,Ag,In,Cu) in the Sn-Based Pb-Free Solders	劉正毓
2019-08-01	Sn/Bi/Zn多層結構形貌及固晶機制研究;Sn/Bi/Zn multiple layer structure morphology and die-attachment mechanism	唐岳凱; Tang, Yue-Kai
2002-06-27	SnAgCu無鉛銲料與BGA之Au/Ni墊層反應之研究; A study in the reactions between SnAgCu lead-free solders and Au/Ni surface finish in BGA packages.	蕭麗娟; Li-Chan Shiau
2003-07-01	SnAgCu系列無鉛銲料應用於先進微電子封裝之研究---Cu濃度影響之探討(I); Lead-Free SnAgCu Solders for Advanced Microelectronic Packaging Applications---A Study on the Effects of Cu Concentration (I)	高振宏
2004-07-01	SnAgCu系列無鉛銲料應用於先進微電子封裝之研究---Cu濃度影響之探討(II); Lead-Free SnAgCu Solders for Advanced Microelectronic Packaging Applications---A Study on the Effects of Cu Concentration (II)	高振宏
2005-07-01	SnAgCu系列無鉛銲料應用於先進微電子封裝之研究---Cu濃度影響之探討(III); Lead-Free SnAgCu Solders for Advanced Microelectronic Packaging Applications---A Study on the Effects of Cu Concentration(III)	高振宏
2024-07-10	SNF效應的理論解釋和高影響力聚類特徵的識別;Theoretical Explanation of the SNF Effects and Identification of High-Impact Clustering Features	陸彥廷; Lu, Yen-Ting
2002-10-01	SnIn Alloys 與 Ni Thin Film介面反應研究;Wetting Reaction Study on SnIn Alloys/Ni Thin Film UBM for Flip Chip C4 Joint	劉正毓
2007-10-01	SnNiCu銲球與基材之界面反應研究; Interfacial Reaction of SnNiCu Solder and Substrate	劉正毓
2007	The SnRK1A protein kinase plays a key role in sugar signaling during germination and seedling growth of rice	Lu,CA; Lin,CC; Lee,KW; Chen,JL; Huang,LF; Ho,SL; Liu,HJ; Hsing,YI; Yu,SM
2010-07-20	SNS遊戲影響社會網路服務持續使用之探討; How Social Network Service Continuance is Affected by SNS Games	臧運祥; Yun-Hsiang Tsang
2016-08-31	Sn矩陣與伴同矩陣的零延拓指數之研究;A Study on Zero-Dilation Index of Sn-Matrix and Companion Matrix	高華隆
2019-07-17	Sn納米粒子的超導電性和自旋極化;Superconductivity and Spin Polarization in Sn Nanoparticles	Zainollah; Ahmad
2008-10-20	SOA方法在企業系統的發展現況探討; A Study of Major Currents of SOA Approaches in Enterprise Systems	李佳蓉; Chia-Jung Lee
2009	Social conversation and effective discussion in online group learning	Chen,FC; Wang,TC
2023-07-21	Social Criticism in Huang Hsin-Yao′s The Great Buddha +	江淑英; Chiang, Shu-Ying

顯示項目22651-22700 / 81569. (共1632頁) << < 449 450 451 452 453 454 455 456 457 458 > >> 每頁顯示[10|25|50]項目