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日期	題名	作者
2007-06-01	無腹地河川污染整治可行性工法研究; Feasibility Study of River Water Treatment Methods for Land-limited Conditions	廖萬里; 秦靜如
2006-07-13	無腹筋RC梁利用壓拉桿模式預測剪力強度之研究; Analytical Study on RC Beams Without Steel Stirrups by Means of Strut-and-Tie Model	蕭乃維; Nai-Wei Hsiao
2004-06-17	無行為能力病人的醫療代理決策研究：以智能障礙者為例; On Surrogate Decision Making of Mentally Handicapped Patient	陳光增; Kuang-Tseng Chen
2020-09-10	無軸承離心泵中心偏移補償方法;The Compensation Method for Mass Eccentricity of Bearingless Centrifugal Pump	楊智鈞; Yang, Chih-Jiun
2019-08-15	無軸承離心泵控制	江育昇; Chiang, Yu-Sheng
2001-07-07	無轉軸偵測元件之無刷直流馬達驅動器研製; Implementation of a Brushless DC motor without a Rotor Position Sensor	陳志成; Zhi-Cheng Chen
2001-07-07	無轉軸偵測元件之開關磁阻馬達驅動系統研製; Implementation and Design of a Switched reluctance Drive system without a Rotor Position Sensor.	楊義隆; Yi-Long Young
2005-06-21	無轉速感測元件之跑步機驅動系統	王森義; Sen-Yi Wang
2003-06-23	無速度感測器之直接轉矩控制感應馬達驅動器設計; Design of sensorless direct torque control for induction motor drives	曾仁煒; Zen-Wei Tseng
2001-07-16	無道碴軌道型式決策模式之研究(應用價值工程及多屬性決策理論)	李義彪; Yi-Biao Li
2013-01-24	無鉛熔錫波銲製程實驗之探討;Experiments of lead-free wave soldering investigate process	賴振同; Lai,Cheng-tung
2017-07-17	無鉛製程用之小量多樣PCB焊接烤箱開發;Development of small batch multi - pattern PCB welding oven for lead - free process.	蔡曜安; Tsai, Yao-An
2003-07-01	無鉛銲料之薄膜UBM研究; Interfacial Reaction and Spalling Effect between Pb-Free Solders and Ni-Base Alloy Thin Film UBM	劉正毓
2014-07-29	無鉛銲料與擴散阻障層於熱電材料之推力測試研究;Evaluation of shear strength on Pb-free solder/diffusion barrier/Bi2Te3 thermoelectric system	林能億; Lin,Neng-yi
2013-07-30	無鉛銲料與添加鈀層之無電鍍鈷基材界面反應研究; Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface ?nishes	洪嘉宏; Hong,Jia-hong
2015-07-28	無鉛銲料與無電鍍鈷基板於多次迴焊之界面反應與可靠度測試	蔡宜伶; Tsai,Yi-lin
2011-07-26	無鉛銲料與碲化鉍基材之界面反應研究; Formation of Intermetallic Compounds in Lead-free Solder systems and thermoelectric materials	林岱瑩; Tai-Yin Lin
2009-07-14	無鉛銲料錫銀鉍銦與銅電極之電遷移研究; The study of Electromigration on Lead-free SnAgBiIn Solder with Cu Electrodes	孫國浩; Kuo-Hao Sun
2010-11-12	無鉛銲料錫銀銦與銅基板的界面反應 ; The Interfacial Reaction of SnAgIn Pb-Free Solder on Cu Substrates	江昱彥; Yu-Yen Chiang
2002-10-01	無鉛銲錫Sn-9Zn-xAG合金最佳成份研究---子計畫VI：Sn-9Zn-xAg系無鉛銲錫應用於先進微電子封裝之研究---界面反應之探討; Lead-Free Sn-9Zn-xAg Solders for Advanced Microelectronic Packaging Applications---An Interfacial Reaction Study	高振宏
2003-07-01	無鉛銲錫Sn-9Zn-xAg合金最佳成份研究---子計畫V：Sn-9Zn-xAg系無鉛銲料應用於先進微電子封裝之研究---界面反應之探討(III); Lead-Free Sn-9Zn-xAg Solders for Advanced Microelectronic Packaging Applications---An Interfacial Reaction Study (III)	高振宏
2001-07-01	無鉛銲錫球格陣列構裝製程與可靠 度分析---子計畫三：無鉛銲錫球格陣列構裝接點之金脆損害機理分析;+B972Gold Embrittlement and Its Mechanism on the Joints Connected with Lead-Free Solders by Ball Grid Array Assembly	林景崎
2003-07-01	無鉛銲錫球格陣列構裝製程與可靠度分析---子計畫III：無鉛銲錫球格陣列構裝接點之遷移及金脆損害分析(III); Failure Analysis on the Migration and Gold Embrittlement of the Joints Connected with Lead-Free Solders by Ball Grid Array Assembly (III)	林景崎
2002-07-01	無鉛銲錫球格陣列構裝製程與可靠度分析---子計畫III：無鉛銲錫球格陣列構裝接點之金脆損害機理分析(II); Gold Embrittlement and Its Mechanism on the Joints Connected with Lead-Free Solders by Ball Grid Array Assembly (II)	林景崎
2021-12-21	無錨框物件偵測與追蹤核心輕量化技術開發;Development of Lightweight Technology for Object Detection and Tracking Using Anchor-Free Approach	范國清

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