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    請使用永久網址來引用或連結此文件: https://ir.lib.ncu.edu.tw/handle/987654321/103535


    題名: Effects of Cu content on electrochemical response in Ti-based metallic glasses under simulated body fluid
    作者: 鄭憲清;Huang, C.H.;Lai, J.J.;Huang, J.C.;Lin, C.H.;Jang, J.S.C.
    貢獻者: 工學院材料科學與工程研究所
    關鍵詞: Amorphous materials;AMORPHOUS STRUCTURE;Body Fluids - chemistry;Copper;Copper - chemistry;COPPER ALLOYS (10 TO 40 CU);COPPER IONS;CORROSION;Glass - chemistry;GLASSES;Humans;MATHEMATICAL ANALYSIS;Mathematical models;Metallic glass;Metallic glasses;MICA;Open circuit potential;Pitting;Pitting (corrosion);Polarization;Ti alloy;Titanium;Titanium - chemistry;Zirconium - chemistry
    日期: 2016-05-01
    上傳時間: 2026-04-23 11:32:22 (UTC+8)
    出版者: Elsevier BV;Netherlands: Elsevier B.V
    摘要: 摘要: Systematic characterization of the corrosion response of the Cu-free Ti45Zr40Si15 and Cu-containing Ti40Zr40Si15–Cu5 and Ti45Zr20–Cu35 metallic glasses (MGs) in the Hank's solution is conducted, in terms of the open circuit potential, potentiodynamic polarization, as well as electrochemical impedance measurements. The Cu role in the Ti-based MGs, tentatively to be applied for bio-implants, is established and modeled. The presence of nobler Cu will impose two opposite effects. The minor positive effect of minor shift of Ecorr is not a major issue, but the negative effect on local pitting and ion release would cause a major drawback. The ICP-MS indicates that the release of Cu ions increases with increasing Cu content. For more promising anti-pitting ability, the Cu content in Ti-based MGs should be kept as low as possible, better to be none or less than about 5at.%. [Display omitted] •The electrochemical response of Ti–Zr–Si–(Cu) metallic glasses in simulated body fluid is explored.•Cu would lead the local pitting and ion release in simulated body fluid.•Cu should keep low to none or less than 5at.% for bio-implant purpose.
    其他題名: Mater Sci Eng C Mater Biol Appl
    出版者: Netherlands: Elsevier B.V
    出版日期: 2016-05-01
    出處: Materials Science & Engineering C, 2016-05, Vol.62, p.368-376
    資源來源: Elsevier ScienceDirect Journals Complete - AutoHoldings
    版權: 2016 Elsevier B.V.
    版權: Copyright © 2016 Elsevier B.V. All rights reserved.
    識別號: ISSN: 0928-4931
    識別號: EISSN: 1873-0191
    識別號: DOI: 10.1016/j.msec.2016.01.080
    識別號: PMID: 26952435
    顯示於類別:[材料科學與工程研究所 ] 期刊論文

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