Local melting induced by electromigration in flip-chip solder joints

NCUIR > Engineering College > Institute of Materials Science and Engineering > journal & Dissertation > Item 987654321/29848

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29848

Title:	Local melting induced by electromigration in flip-chip solder joints
Authors:	Tsai CM,Lin YL,Tsai JY,Lai YS,Kao CR
Contributors:	材料科學與工程研究所
Keywords:	UNDER-BUMP METALLIZATION;EUTECTIC SNPB;INDUCED FAILURE;DISSOLUTION;MECHANISM
Date:	2006
Issue Date:	2010-07-06 15:59:18 (UTC+8)
Publisher:	中央大學
Abstract:	A new electromigration failure mechanism in flip-chip solder joints is reported. The solder joints failed by local melting of a PbSn eutectic solder. Local melting occurred due to a sequence of events induced by the microstructure changes in the flip-chip
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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