以往，半導體產業跟隨摩爾定律(Moore’s Law)的發展，不過，半導體廠商發現隨著製程不斷微縮之下，不但其製造成本暴增，而且面臨到材料物理特性瓶頸。半導體廠商以”More Moore”及”More than Moore”觀念，打破傳統思維，藉由3D IC來整合架構與思考設計。 本研究之目的，就是分析全世界各主要大廠的 3D IC 專利。試圖找出台灣在相關專利佈局的發展機會。本研究之研究方法主要採取文獻探討法。首先利用期刊、資料庫等文獻，整理出與研究主題相關之內容，包括定義、產業現況，並輔以專家訪談，以達到本研究相關內容之探討目的。以專利分析工具初步檢索USPTO之專利資料，並將專利檢索結果來分析目前並預測未來3D IC產業的發展趨勢，針對領導廠商進行分析，試圖找出未來台灣廠商可能在技術與市場之策略佈局。In the past, the industry of the semiconductor followed Moore' s Law to development, however ,they find that when the process more shrink and then its manufacturing cost increase more quickly, and the material physical characteristic also have bottleneck. The semiconductor manufacturer breaks traditional thinking, combines the structure under designing with 3D IC with " More Moore " and " More than Moore " idea. This research focuses upon the relationship between patent analysis and R&D planning. Patent analysis enables researchers and business executives to assess the competitive patent landscape prior to engaging in costly research and development, patent execution, or merger and acquisition activities. It is not only a powerful weapon in business but also a protective tool. Before planning R&D strategy, the companies have to analyze all related patents of the target technology. This research try to figure out the relationship between patent analysis of 3D IC and R&D strategy from dissimilar view about technology life cycle, the sources of technology, R&D schedule and business model. This research also concludes that the companies should arrange different patent strategies and R&D plans in different developing stages.
