添加微量錫銀銅合金之銅薄膜與銅基板之接合研究

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Title:	添加微量錫銀銅合金之銅薄膜與銅基板之接合研究
Authors:	鐘元亨;Zhong, Yuan-Heng
Contributors:	化學工程與材料工程學系
Keywords:	銅-銅接合;燒結
Date:	2017-08-17
Issue Date:	2017-10-27 12:59:31 (UTC+8)
Publisher:	國立中央大學
Abstract:	在電子構裝中，以銲料為主的覆晶接合方式已經沿用數十年，然而銲料與金屬層或金屬基板在加熱時會反應生成介金屬化合物，產生許多可靠度的問題，因此，許多研究開始朝向直接銅-銅接合的方法以消除這些問題。銅具有良好的導電性以及成本低等優點，但其表面易氧化及汙染的問題仍是直接銅-銅接合所要面臨的一大挑戰。由於表面的氧化以及汙染物會使構裝溫度增加，因此許多研究為了降低構裝溫度，於製程上的環境方面以及表面處理的要求相對嚴格，製造成本也因儀器的使用而增加，因此在本實驗中以微米級的銅顆粒作為介質，並在其中加入微量的錫粉(SAC305)，藉著其低熔點特性與銅反應來補強顆粒連接性的不足，以達到銅-銅接合的目的，其製程簡單，製造成本相對較低，對環境要求也比較不嚴苛。將銅箔表面經研磨處理後，作為接合基板，以化學還原的方式，保護微米銅顆粒表面不被氧化，並添加錫銀銅合金(SAC305)及其他物質作為之溶劑的調整，配製成銅墨，並塗佈於銅箔上，觀察並改善接合狀況，並在不同的溫度、時間以及錫(SAC305)含量的條件下作比較，並在氮氣的條件下完成低溫接合。;Solder bump bonding has been the mainstream in packaging technology for many years. Cu to Cu bonding has been reported in recent years because of its excellent conductivity and low costs. However, great challenges exist for Cu to Cu bonding process due to surface oxidation when fabricated at high bonding temperature. In this study, micron-size Cu particles added with trace amount of SAC305 particles are used to fabricate strong Cu bumps. SAC 305 quickly dissolves in Cu matrix and fills the gaps between the Cu particles by interfacial reaction. Pastes are formed by micron-size Cu and SAC 305 particles dissolving in a solvent to prevent from oxidation by chemical reaction. The pastes are coated on Cu foils to form Cu bumps and aged at various temperatures and times. The Cu coated foils are bonded face-to-face and a continuous void-free Cu bumps at a temperature below 150 oC in a nitrogen environment without external pressure.
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] Electronic Thesis & Dissertation

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