運用KT分析與TRIZ矛盾矩陣於晶圓封裝之製程與檢驗能力改善之研究-以X公司為例;Applying KT Problem Analysis and TRIZ Contradiction Matrix Method to Improving WLCSP Process and Inspection for X Company

NCUIR > School of Management at National Central University > Executive Master of Industrial Management > Electronic Thesis & Dissertation > Item 987654321/83123

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/83123

Title:	運用KT分析與TRIZ矛盾矩陣於晶圓封裝之製程與檢驗能力改善之研究-以X公司為例;Applying KT Problem Analysis and TRIZ Contradiction Matrix Method to Improving WLCSP Process and Inspection for X Company
Authors:	楊蕙菁;Yang, Hui-Ching
Contributors:	工業管理研究所在職專班
Keywords:	晶圓級半導體封裝;KT問題分析;TRIZ 矛盾矩陣;自動光學檢驗;缺陷檢驗;萃思、萃智;WLCSP;KT Problem Analysis;TRIZ Contradiction Matrix Method;AOI (auto optical inspection);Defect Inspection
Date:	2020-06-15
Issue Date:	2020-09-02 14:57:37 (UTC+8)
Publisher:	國立中央大學
Abstract:	半導體產業隨著終端產品的應用領域多變，已成為很多商業化產品的主要元件。而封裝技術的發展也隨之迅速，除了製造精準度與製程良率持續改善高度要求外，提升檢驗能力避免不良品流出引起客戶抱怨及交期延宕也是重要的一環。降低客戶抱怨與售後處理成本，是維持商譽建立企業形象與競爭優勢的永續發展目標之一。半導體因其複雜的製造過程與快節奏的產業供應鏈要求，一旦生產線上發生工程事件，工程師經常面臨的情況是「時間就是成本」。必須在有限的時間內有效而快速地找出問題並提出解決方案，因此，一個好的問題分析工具及創新解決問題思維模式，對協助工程師處理緊急工程事件格外重要。本研究成功運用KT分析法的狀況評估工具與問題差異分析步驟，找出玻璃角落崩塌缺陷漏出，導致組裝製程中斷停線的品質問題與其真因。接續運用TRIZ的三十九技術參數與矛盾矩陣，得到四十創新發明原則的觸發解，作為腦力激盪與實驗設計的依據方向。協助改善小組提出具體的改善方案，分別針對三個構面進行製程缺陷及檢驗能力提升產品良率對策，達到解決玻璃角落崩塌缺陷產生與防止缺陷產品漏出至下游組裝廠的品質目標。;With the ever-changing applications, semiconductors have become the main components of many products. The development of packaging technology has also become rapid. In addition to requiring excellent manufacturing accuracy and continuous improvement in process yield, it is also an important requirement to improve inspection capabilities to avoid outflow of defective products and delays in delivery. Reducing customer complaints and reducing after-sales processing costs is one of the sustainable development goals of maintaining goodwill and establishing an enterprise image and competitive advantage. The semiconductor industry has the characteristics of complex manufacturing processes and fast-paced supply requirements. Once an engineering event occurs on the production line, engineers often face the situation that "time is cost." It is necessary to find problems and propose solutions effectively and quickly within a limited time. Therefore, a good problem analysis tool and innovative problem-solving thinking mode are particularly important for assisting engineers to deal with emergency engineering incidents. In this study, the condition assessment tool and the problem difference analysis steps in the KT analysis method were successfully used to find out the quality problems and the true causes of the breakdown of the glass corner collapse and leakage, which led to the interruption of the assembly process. Successively using TRIZ′s thirty-nine technical parameters and contradiction matrix to get the trigger solution of the forty innovative invention principles, as the basis of brainstorming and experimental design. Assist the improvement team to put forward specific improvement plans, carry out process defects and inspection capabilities to improve product yield countermeasures for the three facets, and achieve the quality goals of solving the problem of glass corner collapse defects and preventing defective products from leaking to downstream assembly plants.
Appears in Collections:	[Executive Master of Industrial Management] Electronic Thesis & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	155	View/Open

社群 sharing

Loading...