| 摘要: | 本研究旨在探討半導體設備製造中，零組件發料流程對生產總工時之影響。由於蝕刻設備具備少量多樣、工序複雜與高度相依特性，物料發放安排若未依工序邏輯進行，將導致搬運、拆裝、等待等非增值作業增加，使生產工時易產生波動並造成產能利用率下降。隨著半導體設備組裝難度提升與產線規模持續擴大，如何透過流程設計優化發料順序，以提升工時穩定性與縮短組裝工時，已成為提升競爭力的重要課題。
在此背景下，本研究以L公司蝕刻設備產線為研究對象，針對影響工時的關鍵流程環節進行分析，包括大型件發放時序、外觀件多次入線造成之重複拆裝，以及主、副生產線作業不同步等問題。本研究結合2024–2025年之實際工時資料、AHS（Activity Hierarchy Structure）活動拆解、現場Gemba Walk觀察，以及半結構式訪談等方法，辨識生產流程中的非增值活動來源，並據以提出三項改善方案，分別聚焦於大型件群組化發料、外觀件批次整合，以及主副線作業同步化。
研究結果顯示，流程改善對生產工時具有正面效益。主生產線工時自改善前之57.6小時逐步下降至方案C之53.5小時；副生產線因外觀件批次化策略使重工與搬運行為減少，工時變異亦顯著改善；測試線則因上游流程穩定度提升而呈現idle time減少。此外，整體Cycle Time亦由原先約27天縮短至26.57天，顯示發料策略與工序配置之調整能有效提升生產節奏一致性與流程可預測性。
本研究結果除可作為L公司後續跨產品線改善參考外，亦對半導體設備製造中物料管理、流程設計與工時控制提供具體管理意涵。研究亦顯示，透過資料驅動的流程診斷與ECRS改善原則之應用，可有效消除非增值活動，減少生產工時並強化製造系統穩定度。
;This study investigates the impact of component material issuance processes on the total production hours in semiconductor equipment manufacturing. Due to the characteristics of etch equipment—high product mix, complex assembly sequences, and strong interdependence across workstations—improperly arranged material issuance timing may lead to non-value-added activities such as repeated handling, reassembly, and waiting. These inefficiencies in turn increase variability in production hours, reduce capacity utilization, and undermine the stability of delivery performance. As equipment complexity continues to rise and global manufacturing sites expand, optimizing material issuance logic to enhance production stability has become a critical element of operational competitiveness.
Using the etch equipment assembly lines of Company L as the research case, this study analyzes key process bottlenecks affecting production hours, including the timing of large-component issuance, repeated re-entry of appearance parts, and asynchronous operations between the main and sub assembly lines. Multiple data sources and analytical approaches were employed, including 2024–2025 production-hour datasets, Activity Hierarchy Structure (AHS) analysis, on-site Gemba Walk observations, and semi-structured interviews with production personnel. Based on the identified bottlenecks, three improvement strategies were proposed: grouped issuance for large components, batch consolidation for appearance parts, and synchronization of main and sub assembly lines.
The empirical results demonstrate that all three improvement strategies contribute positively to reducing production hours and stabilizing process performance. Main-line production hours decreased from 57.6 hours before improvement to 53.5 hours under Strategy C. The consolidation of appearance parts significantly reduced rework and unnecessary handling on the sub line, thereby decreasing variability. The test line also benefited from reduced idle time due to more stable upstream processing. The overall Cycle Time was shortened from approximately 27 days to 26.57 days, indicating that better material issuance strategy and process coordination can enhance flow consistency and improve system predictability.
The findings of this study provide actionable insights for Company L to extend improvements across multiple product families. More broadly, the results contribute to understanding how material management, process design, and work-hour control can be optimized in semiconductor equipment manufacturing. The study highlights that data-driven diagnosis combined with ECRS principles can effectively eliminate non-value-added activities, improve production efficiency, and enhance the stability of manufacturing systems. |
