| 摘要: | 本研究針對印刷電路板(PCB)製程之尺寸量測與瑕疵檢查需求，提出一套自製自動光學檢測(AOI)設備之設計與驗證流程。系統架構涵蓋花崗岩平台、焊接機架、X、Y、Z 運動模組、高倍率光學量測模組與背光模組，並以有限元素分析評估主體結構在靜態負載、慣性力與模態特性下之變形與固有頻率，以作為幾何精度與結構優化之依據。
在設備組裝後，依據 ISO 230-1 與 ISO 230-2 標準，分別以花崗岩尺規、接觸式數位感測器與雷射干涉儀進行直線度與平行度等幾何精度驗證。其後利用雷射干涉儀建立軸向定位補償模型，並以玻璃光罩上的棋盤格進行座標映射，用以修正平台於全域量測範圍內之體積誤差。
最終再以玻璃光罩進行定位精度與重複精度量測驗證，補償後量測結果顯示，定位精度與重複精度皆符合設計目標。另於瑕疵檢查測試中，系統亦能穩定辨識 PCB 上之特徵與缺陷，檢出能力符合預期。綜合上述結果，本研究所提出之 AOI 系統硬體設計已達成 PCB 精密量測與瑕疵檢查所需之性能，確認整體設計流程、結構分析方法與補償策略的可行性。
;This study proposes a design and verification process of a self-developed Automated Optical Inspection (AOI) system to meet the requirements of dimensional measurement and defect detection in Printed Circuit Board (PCB) manufacturing. The system architecture comprises a granite platform, welded machine frame, X–Y–Z motion modules, a high-magnification optical measurement module, and a backlight module. Finite element analysis was employed to evaluate the structural deformation and natural frequencies of the main body under static loading, inertial forces, and modal conditions, providing a basis for geometric accuracy assessment and structural optimization.
After system assembly, geometric accuracy verification was performed in accordance with ISO 230-1 and ISO 230-2, using granite rulers, a contact-type digital gauge, and a laser interferometer to assess straightness, parallelism, and other geometric errors. A positioning compensation model for each axis was subsequently established using the laser interferometer, while a chessboard pattern on a glass photomask was used to conduct coordinate mapping and correct volumetric errors across the measurement area.
Finally, positioning accuracy and repeatability were validated using the same glass photomask. The compensated results demonstrated that both accuracy and repeatability met the design targets. In defect-inspection tests, the system reliably identified PCB features and defects, achieving the expected detection capability. Overall, the proposed AOI system successfully fulfills the performance requirements for precision PCB measurement and defect inspection, confirming the feasibility of the design workflow, structural analysis approach, and compensation strategies. |
