當冷空氣流經高溫晶片陣列時，高溫晶片會使冷空氣在晶片陣列前端得到加熱，使得位於晶片陣列空氣流動路徑後端之晶片冷卻不足，造成晶片陣列溫度分佈不均的問題。因此本實驗設計多風道放在晶片陣列上方，將冷空氣平均分配至每個發熱晶片上，但是此多風道的每個出風口風量不會相同，故需要在多風道中加入數個導流板讓每個出風口的風量盡量相同，以均勻散熱晶片陣列上每個發熱晶片。利用所設計的多風道之每個出風口的風速值來觀察多風道流動分佈情形，實驗參數有不同導流板角度設置、不同導流板擺放位置以及兩個導流板的不同組合。 由實驗結果得知在多風道內加入兩個傾斜45°的導流板分別放置距離多風道入口118 mm與333 mm之流動分佈最為均勻，利用此設計之多風道能使晶片陣列能均勻散熱。 ;When cold air flows across a high-temperature chip array, the upstream chips heat the incoming air, causing the cooling air temperature to rise. As a result, the downstream chips receive insufficient cooling, leading to a non-uniform temperature distribution across the chip array. To solve this problem, multi air ducts are designed and installed above the chip array to distribute the cold air evenly to each heated chip. However, the airflow rates at the outlets of the multi air ducts are not identical. Therefore, several guide plates are set inside the multi air ducts to regulate the airflow so that each outlet can achieve nearly equal flow rates, thereby ensuring uniform heat dissipation of the chip array. The airflow distribution of the multi air ducts is evaluated using the outlet air velocity at each outlet. The experimental parameters include different guide plate angles, various guide plate positions, and different combinations of two guide plates. The experimental results indicate that the most uniform flow distribution is obtained when two guide plates inclined at 45° are installed at distances of 118 mm and 333 mm from the inlet of the multi air ducts. With this optimized design, the chip array achieves uniform heat dissipation.
