| 摘要(英) |
In this thesis, we study the processing technology of eutectic Gold/Tin alloy for an extra-large-size LED die. We develop the recipe of eutectic process and analyze the characteristic of measuring results. The corresponding parameters include highest temperature, temperature profile, bonding force, nitrogen condition and flux for eutectic process. In the measurement procedures of die bonding process, we apply infrared system to measure the thermal resistance and use bonding tester to estimate the die shear strength. Bonding state between die and substrate is inspected by scanning acoustic microscope. Finally, we compare the characteristic of experimental results, including silver paste, high thermal conductivity silver epoxy adhesive, solder paste, solder perform, among difference die bonding processes.
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| 參考文獻 |
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