流程導向為基礎之協同設計鏈作業參考模型－以半導體IC基板為例

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姓名

張博鈞(Bo-Jyun Chang) 查詢紙本館藏

畢業系所

工業管理研究所

論文名稱

流程導向為基礎之協同設計鏈作業參考模型－以半導體IC基板為例
(A Process-oriented Based Collaborative Design Chain Operations Reference Model-A Case Study of Semiconductor IC Substrate.)

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摘要(中)

新產品開發為一個具有高度互動性的流程，隨著電子產品所需處理的複雜度不斷上升之趨勢下，使得新產品的開發越來越為困難。而產品的生命週期卻越來越短，往往僅有六個月，近八成的利潤來自於新產品推出的前三個月，新產品需能即時上市，以因應市場多變化之需求。因此產品開發流程需要透過協同設計的方式來進行。
設計鏈作業參考模型（Design-Chain Operations Reference- model, DCOR）主張能透過該模式幫助企業進行設計鏈分析與促進成員溝通，企業可以用其提供之共通專業術語，分析和設計其設計鏈作業所需之架構與流程，並建立設計鏈之基本架構。
本研究以台灣半導體基板（substrate，為半導體下游產業晶片封裝之關鍵零組件）為主要探討對象，以流程導向及階層式之架構手法，分析基板設計與驗證之流程，並透過DCOR與設計結構矩陣（Design Structure Matrix, DSM）發掘問題並提出改善建議，以簡化設計流程及設計時不必要的浪費，以提升基板設計鏈效率。

摘要(英)

New product development is a highly interactive process, with the trend of rising complexity of electronic products, new product development is increasingly difficult. Product life cycle become shorter only remaining six months, 80% of the profits from first three months of launch new product. New products needs onto the market immediately to response the demand. Therefore, new product development must through the collaborative design to improvement process.
DCOR can help enterprises to analyze the design chain and facilitating member communication. Enterprise can use the standard language to analyze the design chain operations required and establish the basic structure of design chain.
This study is a case study for Taiwan semiconductor substrate. Substrate is the key of the package for semiconductor downstream industries. We used the process-oriented and hierarchical architecture practices to analyze the design and verification substrate process. Through the DCOR and DSM to explore problem and give suggestion, in order to simplify the process of unnecessary waste and enhance the efficiency of substrate design chain.

關鍵字(中)

★ 新產品開發
★ 協同設計
★ 設計鏈作業參考模型
★ 設計結構矩陣
★ 基板

關鍵字(英)

★ new product development
★ DCO
★ collaborative design

論文目次

摘要 i
目錄 iii
圖目錄 v
表目錄 vi
第一章. 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 2
1.3 研究限制 3
1.4 論文架構 3
第二章. 文獻探討 5
2.1 協同產品開發 5
2.1.1 產品開發的協同設計 5
2.1.2 提早參與 9
2.2 設計結構矩陣 10
2.2.1 設計結構矩陣介紹 10
2.2.2 設計結構矩陣的分割 13
2.3 設計鏈作業參考模型 16
2.3.1 DCOR的三大類流程型態 16
2.3.2 DCOR的五大基本流程 17
2.3.3 DCOR各項層級模型 19
第三章. 基板設計鏈 25
3.1 積體電路（integrated circuit, IC）基板與封裝 25
3.1.1 晶片封裝技術 28
3.2 台灣現階段基板設計流程 29
3.3 現階段基設計鏈之問題 32
第四章. 基板設計鏈作業參考模型 34
4.1 基板設計鏈作業參考模型之建構 34
4.1.1 S-DCOR第一階層模型之建構 35
4.1.2 S-DCOR第二階層模型之建構 37
4.1.3 S-DCOR第三階層模型之建構 39
4.1.4 S-DCOR第四階層模型之建構 42
4.2 設計結構矩陣與DCOR之應用 45
第五章. 效益分析 47
5.1 協同設計資訊觀點 48
5.2 BPR專案管理觀點 49
5.3 企業流程再造角度觀點 50
5.4 標準流程觀點 50
第六章. 結論與未來研究 52
6.1 結論 52
6.2 未來研究 54
參考文獻 55

參考文獻

1. Ali, Y., Dan, B., “Complex concurrent engineering and the design structure matrix method”, Concurrent Engineering: Research and Applications, 2003.
2. Buyukozkan, G., Arsenyan, J., “Collaborative product development: a literature overview”, Production Planning & Control, Vol. 23, No. 1, pp. 47-66, 2012.
3. Chen, M. K., Sun, W. Y., “The application of collaborative design in Taiwan’’s textile industry”, International Journal of Electronic Business Management, Vol. 8, No. 1, pp. 31-42, 2010.
4. Choi, Y., Kang, K., Chae, H., Kim, K., “An enterprise architecture framework for collaboration of virtual enterprise chains”, International Journal Advantage Manufacture Technology, Vol. 35, pp. 1065-1078, 2008.
5. Chris, A., Christine, S., Ryan B., “Process Classiﬁcation Frameworks”, Handbook on Business Process Management 2, International Handbooks on Information Systems, 2010.
6. Eppinger, S. D., Whitney, D. E., Smith, R. P., Gebala, D. A., “A model-based method for organizing tasks in product development”, Research in Engineering Design, Vol. 6, pp. 1-13, 1994.
7. Fagerstrom, B., Jackson, M., “Efficient collaboration between main and sub-suppliers”, Computers in Industry, Vol. 49, pp. 25-35, 2002.
8. Hammer, M., “Reengineering work: don’’t automate, obliterate”, Harvard Business Review, Vol. 68, pp. 104-112, 1990.
9. Huang, G. Q., Mak, K. L., “Early supplier involvement in new product development on internet: implementation perspectives”, Concurrent Engineering: Research and Application, Vol. 8, No. 1, pp. 40-49, 2000.
10. Hwang, B. N., Chang, S. C., Yu, H. C., Chang, C. W., “Pioneering e-supply chain integration in semiconductor industry: A case study”, International Journal of Advanced Manufacturing Technology, Vol. 36, pp. 825-832, 2008.
11. Jassawalla, A. R., Sashittal, H. C., “An examination of collaboration in high-technology new product development processes,” Journal of Product Innovation Management, Vol. 15, pp. 237-254, 1998.
12. Jagdev, H. S., Thoben, K. D., “Anatomy of enterprise collaborations”, Prod Plan Control, Vol. 12, pp. 437-451, 2001.
13. Juan, Y. C., Ou, Y. C., Lin, J. S., “A process-oriented multi-agent system development approach to support the cooperation-activities of concurrent new product development”, Computers & Industrial Engineering, Vol. 57, pp. 1363-1376, 2009.
14. Kvan, T., “Collaborative design: what is it?”, Automation in Construction, Vol. 9, pp. 409-415, 2000.
15. Kleinsmann, M., Buijs, J., Valkenburg, R., “Understanding the complexity of knowledge integration in collaborative new product development teams: A case study”, Journal of Engineering and Technology Management, Vol. 27, pp. 20-32, 2010.
16. Knutilla, A., “Process specification language: an analysis of existing representations”, NIST Project Report, 1998.
17. Lawrence, P., Bouzeghoub, M., Fabret, F., Matulovic-broque, M., “Workflow Handbook”, Workflow management Coalition, John Wiley & Sons, New York, 1997.
18. Lee, Y. C., Gilleard, J. D., “Collaborative design: A process model for refurbishment,” Automation in Construction, Vol. 11, pp. 535-544, 2002.
19. Prasad, B., “Concurrent engineering fundamentals-integrated product and process organization”, Prentice Hall, 1996.
20. Schmitz, B., “CAE 2000−collaborating into the future”, Computers Aided Engineering, 2000.
21. Steward, D. V., “The design structure system: A method for managing the design of complex systems”, IEEE Transactions on Engineering Management, Vol. 28, No. 3, pp. 71-74, 1981.
22. Supply-Chain Council., “Design-Chain Operations Reference-model, Version 1.0.”, 2006.
23. Supply-Chain Council., “Next release of the design-chain operations reference-model (DCOR), Version 2.0”, 2009.
24. Sohlenius, G., “Concurrent engineering”, CIRP Annals-Manufacturing Technology, Vol. 41, pp. 645-655, 1992.
25. Skjoett-Larsen, T., Thernoe, C. Andresen, C., “Supply chain collaboration theoretical perspectives and empirical evidence”, International Journal of Physical Distribution & Logistics Management, Vol. 33, pp. 531-549, 2003.
26. Surgency Inc., “Best Practices in Collaborative Design”, White Paper, 2001.
27. Tien, F. C., Tsai, C. Y., “Computer-aided inspection for substrate design”, International Journal of Advanced Manufacturing Technology, Vol. 23, pp. 279-287, 2004.
28. Wang, L., Shen, W., Xie, H., Neelamkavil, J. and Pardasani, A., “Collaborative conceptual design-state of art and future trends”, Computer-Aided Design Vol. 33, pp. 981-996, 2002.
29. Weske, M., Aalst, W. M. P., Verbeek, H. M. W., “Advances in business process management”, Data & Knowledge Engineering, Vol. 50, pp. 1-8, 2004.
30. Wu, W. H., Yeh, S. C., Fang, L. C., “The development of a collaborative design chain reference model for the motorcycle industry”, International Journal of Advanced Manufacturing Technology, Vol. 35, pp. 211-225., 2007.
31. LED 及半導體封裝演進，http://www.full-sun.com.tw/images/related/r03.pdf，2012，上網時間：2012年3月2日。
32. 江柏風，「2010年全球三大之台灣產業產品-IC載板」，經濟部技術處ITIS計劃，工業技術研究院資訊中心，2011。
33. 薩歐，羅正忠，張鼎張，「半導體製程技術導論」，2002。
34. 蕭傳議，「封裝帶動國內IC載板產業發展」，經濟部技術處ITIS計劃，工業技術研究院資訊中心，2004。
35. 新聞大字報，「友達結盟日廠拚OLED市場」，http://twb.zhreader.com/2012/02/oled.html ，2012，上網時間：2012年2月3日。

指導教授

王啟泰(Chi-tai Wang)

審核日期

2012-7-12

推文