應用於投射電容式觸控面板之良率增強技術

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廖偉勛(Wei-Hsun Liao) 查詢紙本館藏

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電機工程學系在職專班

論文名稱

應用於投射電容式觸控面板之良率增強技術
(Yield-Enhancement Techniques forProjected Capacitive Touch Panels)

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摘要(中)

在觸控面板技術快速發展的現今，觸控面板線路的設計與製程技術，決定產品良率與生產成本的關鍵。本論文針對投射電容式觸控面板金屬導線的光罩設計與製程技術，提出補償設計與製程改善之方案。在論文第一部分，我們提出避免金屬導線被刮傷或斷線的PI(passivation insulator) Half-Tone光罩設計方案。利用調整光罩上遮光圖案的寬度與相對間距，讓曝光能量適當穿過光罩，使玻璃上所塗佈的光阻形成不同寬度與不同深度的PI溝渠圖形，經由光學顯微鏡的檢查挑選出符合金屬導線規格的PI溝渠圖形，使後續的製程將金屬導線埋藏其中，達到保護金屬導線的有效功能，大幅減少金屬導線因為刮傷所造成的功能性故障問題。在論文第二部分，我們提出金屬導線製程良率的改善方案。利用OPC (optical proximity correction)技術在金屬導線層光罩上補償金屬導線的CD(critical dimension)損失值。然後在利用過度曝光與過度顯影的製程將金屬導線觸控線路埋置於PI溝渠絕緣保護層中，減少因為製造過程中造成觸控面板金屬導線斷線與刮傷的良率損失。此項方法可以提升金屬導線的製程良率。使用此方法將可減少研發費用，並能使產品快速導入量產與節約成本。

摘要(英)

With the rapid development of touch panel technology, the design and process technologies of touch panel circuitry have become the keys to production yield rate and manufacturing cost. In this thesis the plans for compensation design and process improvement have been proposed with respect to the photomask design and process technology of metal jumper wires of projected capacitive touch panel. A PI (passivation insulator) half-tone photomask design will be proposed in the first section to avoid scratched or broken metal jumper wires. The widths and pitches of photomask patterns will be adjusted to allow sufficient exposure light to penetrate through the photomask and to result in PI trenches with different widths and depths on the PI pattern. In the second section, a plan for improving the production yield rate of metal jumper wires will be proposed by incorporating OPC (optical proximity correction) on the metal jumper wire photomask to compensate the metal jumper wire CD (critical dimension) loss. Utilizing over-exposure and over-development fabrication processes, the conductive metal jumper wire can be embedded into the protective PI layers in order to reduce the loss of production yield rate due to wire scratch damage and breakage during the manufacturing process. With this method the production yield rate of the metal jumper wires can be improved, and the R&D costs can be reduced in order to achieve the rapid mass production and cost reduction of such product.

關鍵字(中)

★ 觸控面板

關鍵字(英)

論文目次

摘要 …………………………………………………………………………………i
Abstract …………………………………………………………………………ii
目錄 ………………………………………………………………………………iii
圖目錄 ……………………………………………………………………………vi
表目錄 ………………………………………………………………………………x
第一章緒論…………………………………………………………………………1
1.1論文研究動機與目的 …………………………………………………………1
1.2 文獻回顧 … …………………………………………………………………1
1.2.1觸控面板技術介紹 …………………………………………………………1
1.2.2 觸控面板特性與功能 ……………………………………………………10
1.3 論文架構… …………………………………………………………………11
第二章 PI Half-Tone光罩與金屬導線OPC光罩設計方案 …………………12
2.1 傳統投射電容式觸控面板製程問題簡介 …………………………………12
2.2 PI Half-Tone光罩與金屬導線OPC光罩設計方法………………………14
2.2.1 PI Half-Tone測試光罩設計方法 ……………………………………15
2.2.2 金屬導線OPC測試光罩設計方法 ………………………………………17
2.3 使用PI Half-Tone光罩與金屬導線OPC光罩製造產品流程……………19
2.3.1 使用PI Half-Tone光罩製造產品流程 ………………………………19
2.3.2 使用金屬導線OPC光罩製造產品流程 …………………………………20
2.4 使用PI Half-Tone光罩與金屬導線OPC光罩製造產品實驗結果………22
第三章應用統計方法分析PI Half-Tone光罩與金屬導線OPC光罩技術對傳統製程良率改善方案…………………………………………………………………24
3.1 過度曝光與過度顯影技術介紹 ……………………………………………24
3.1.1 光阻標準曝光圖形化製造流程 …………………………………………24
3.1.2 光阻過度曝光圖形化製造流程 …………………………………………25
3.2 統計方法分析傳統製程無金屬導線OPC光罩技術曝光與顯影數據………26
3.2.1 傳統製程無OPC技術標準曝光與標準顯影金屬導線數據分析…………27
3.2.2 傳統製程無OPC技術標準曝光與過度顯影金屬導線數據分析…………29
3.2.3 傳統製程無OPC技術過度曝光與標準顯影金屬導線數據分析…………30
3.2.4 傳統製程無OPC技術過度曝光與過度顯影金屬導線數據分析…………32
3.2.5 根據實驗結果以統計方法分析傳統製程無OPC技術金屬導線數據……32
3.3 統計方法分析金屬導線OPC光罩技術製程曝光與顯影數據………………33
3.3.1 OPC光罩技術標準曝光與標準顯影金屬導線數據分析 ………………34
3.3.2 OPC光罩技術標準曝光與過度顯影金屬導線數據分析 ………………36
3.3.3 OPC光罩技術過度曝光與標準顯影金屬導線數據分析 ………………37
3.3.4 OPC光罩技術過度曝光與過度顯影金屬導線數據分析 ………………39
3.3.5 根據實驗結果以統計方法分析OPC光罩技術製程金屬導線數據………41
3.4 根據實驗結果分析比較傳統製程與OPC光罩技術製程金屬導線數據……42
3.5 統計方法分析金屬導線OPC光罩技術製程過度曝光與過度顯影數據……43
3.5.1 製程最佳化驗證參數條件A ……………………………………………44
3.5.2 製程最佳化驗證參數條件B ……………………………………………46
3.5.3 製程最佳化驗證參數條件C ……………………………………………48
3.5.4 製程最佳化驗證參數條件D ……………………………………………50
3.6 根據實驗結果以統計方法分析比較傳統製程與製程最佳化條件數據 …51
第四章結論與未來展望 …………………………………………………………57
參考文獻……………………………………………………………………………59

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指導教授

李進福(Jin-Fu Li)

審核日期

2013-7-25

推文