鎖相熱影像檢測法用以檢測材料內部缺陷

以作者查詢圖書館館藏

、以作者查詢臺灣博碩士

、以作者查詢全國書目

、勘誤回報

、線上人數：45

、訪客IP：18.222.182.195

姓名

陳贊年(Tsan-nien Chen) 查詢紙本館藏

畢業系所

光電科學與工程學系

論文名稱

鎖相熱影像檢測法用以檢測材料內部缺陷
(Internal defect detection using lock-in thermography)

相關論文

★ 以體積全像布拉格光柵為反射鏡之單縱模波長可調式V型共振腔鈦藍寶石固態雷射研究	★ 以體積全像布拉格光柵為反射鏡之外腔式半導體雷射研究
★ 已體積布拉格光柵為可調反射率輸出雷射鏡研究	★ 以錐形半導體放大器為增益介質、外腔VBG回饋半導體雷射研究
★ 利用楔形稜鏡與繞射光柵設計非光線追跡薄型太陽能集光器	★ 以體積布拉格光柵為共振腔反射鏡之有效腔長研究
★ 穩態紅外線LED封裝熱阻量測	★ 以體積布拉格光柵作為雷射共振腔內反射鏡之縱向模態研究
★ 以光激發螢光影像量測矽太陽能電池額外載子生命期及串聯電阻分佈之研究	★ 以體積布拉格光柵作為雷射共振腔反射鏡之橫模行為研究
★ 光聲影像顯微術之研究	★ 光激發額外載子於太陽能電池內空間分佈之二維軸對稱與二維線對稱物理參數模擬
★ 基於純量繞射理論以遠場聲場重建光聲影像之研究	★ 基於光聲訊號之三維資訊重建
★ 以動態模型分析PQ:PMMA作為體積布拉格光柵之繞射效率研究	★ 紅外線穩態熱阻量測法之石墨層影響之研究

檔案

[Endnote RIS 格式]

[Bibtex 格式]

[相關文章]

[文章引用]

[完整記錄]

[館藏目錄]

[檢視]

[下載]

本電子論文使用權限為同意立即開放。
已達開放權限電子全文僅授權使用者為學術研究之目的，進行個人非營利性質之檢索、閱讀、列印。
請遵守中華民國著作權法之相關規定，切勿任意重製、散佈、改作、轉貼、播送，以免觸法。

摘要(中)

本篇論文建立一套非接觸式、非破壞性的檢測物體內部缺陷深度與半徑的方法，利用在鎖相熱成像法中在物體輸入周期性變化的熱功率的特性導入熱波原理，藉由熱波原理控制檢測的深度。並根據有限元素分析軟體對不同缺陷深度與半徑進行模擬的結果建立一套使用週期性熱功率量測物體後，可以從量測的結果推算出在物體內部缺陷分布情形，並且同時得知缺陷深度與半徑的方法，最後進行實驗對模擬的結果進行確認。

摘要(英)

This research successfully builds a non-destructive, non-contact detection method of determining the internal defect depth and defect radius in samples. In lock-in thermography method, the samples are measured by periodically changed heat flux. The effect about periodically changed heat flux is known as thermal wave effect. As thermal wave effect shows, the detection depth is related with the frequency of heat flux By finite element analysis software, the defect depth and defect radius we can be measured after using two difference frequency heat power detect a sample. The simulation results are proved by experiment.

關鍵字(中)

★ 鎖相熱成像
★ 熱
★ 缺陷
★ 檢測

關鍵字(英)

★ Lock-in thermography
★ Heat
★ Defect
★ Detect

論文目次

摘要 I
ABSTRACT II
致謝 III
目錄 IV
圖目錄 VII
表目錄 XI
第一章緒論 1
1.1 前言 1
1.2文獻回顧 6
1.3研究動機與目的 8
第二章基本原理 10
2.1 基本熱傳原理 10
2.1.1 熱傳導 10
2.1.2 熱對流 13
2.1.3 熱輻射 14
2.2 熱波現象 15
2.3 鎖相原理 17
2.4 暫態鎖相誤差修正 20
第三章模擬分析 23
3.1 引言 23
3.2 有限元素分析法 23
3.3 模擬模型建立 25
3.4 模擬結果與誤差分析 31
3.4.1 缺陷寬度與深度分析 31
3.4.2 各種環境條件誤差分析 39
3.4.3 不同材質與幾何結構情況下驗證 47
第四章實驗驗證與分析 50
4.1 實驗架構 50
4.2 紅外線熱像儀誤差分析 54
4.3 實驗與模型驗證 55
第五章結論 65
第六章未來展望 66
參考資料 68
附錄一 LED樣品量測結果 70
附錄二熱波的干涉現象 73

參考文獻

[1] L. inside. http://www.ledinside.com.tw/global_f_f_200901
[2] H. J. Round, "A note on carborundum," Electrical world, vol. 49, p. 309, 1907.
[3] N. Holonyak and S. Bevacqua, "Coherent (visible) light emission from Ga (As1− xPx) junctions," Applied Physics Letters, vol. 1, pp. 82-83, 1962.
[4] J. Allen, M. Moncaster, and J. Starkiewicz, "Electroluminescent devices using carrier injection in gallium phosphide," Solid-State Electronics, vol. 6, pp. 95-102, 1963.
[5] H. Grimmeiss and H. Scholz, "Efficiency of recombination radiation in GaP," Physics Letters, vol. 8, pp. 233-235, 1964.
[6] M. Craford, R. W. Shaw, A. Herzog, and W. Groves, "Radiative recombination mechanisms in GaAsP diodes with and without nitrogen doping," Journal of Applied Physics, vol. 43, pp. 4075-4083, 1972.
[7] S. Nakamura, T. Mukai, M. Senoh, and N. Iwasa, "Thermal annealing effects on p-type Mg-doped GaN films," Jpn. J. Appl. Phys, vol. 31, pp. L139-L142, 1992.
[8] S. Nakamura, M. Senoh, N. Iwasa, and S.-i. Nagahama, "High-brightness InGaN blue, green and yellow light-emitting diodes with quantum well structures," Japanese Journal of Applied Physics, vol. 34, pp. L797-L799, 1995.
[9] Y. Shimizu, K. Sakano, Y. Noguchi, and T. Moriguchi, "Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material," ed: Google Patents, 1999.
[10] 美國能源部. http://www.libnet.sh.cn:82/gate/big5/www.istis.sh.cn/list/list.aspx?id=7081
[11] Cree. http://www.cree.com/led-components-and-modules/products/xlamp/discrete-directional/xlamp-mlb
[12] X. Maldague, "Theory and practice of infrared technology for nondestructive testing," 2001.
[13] G. Giorleo and C. Meola, "Comparison between pulsed and modulated thermography in glass–epoxy laminates," NDT & E International, vol. 35, pp. 287-292, 2002.
[14] S. Huth, O. Breitenstein, A. Huber, D. Dantz, U. Lambert, and F. Altmann, "Lock-in IR-thermography-A novel tool for material and device characterization," in DIFFUSION AND DEFECT DATA PART B SOLID STATE PHENOMENA, 2002, pp. 741-746.
[15] X. Maldague and S. Marinetti, "Pulse phase infrared thermography," Journal of Applied Physics, vol. 79, pp. 2694-2698, 1996.
[16] J. P. Holman, Heat transfer: McGraw-Hill, 1989.
[17] G. Busse, D. Wu, and W. Karpen, "Thermal wave imaging with phase sensitive modulated thermography," Journal of Applied Physics, vol. 71, pp. 3962-3965, 1992.
[18] O. Breitenstein and M. Langenkamp, Lock-In Thermography: Basics and Use for Functional Diagnostics of Electronic Components: Springer Verlag, 2003.
[19] G. Giorleo and C. Meola, "Location and geometry of defects in composite laminates from infrared images," Journal of materials engineering and performance, vol. 7, pp. 367-374, 1998.
[20] 陳憬憲, 穩態紅外線 LED 封裝熱阻量測,國立中央大學光電所碩士論文, 2010.
[21] J. Shen and A. Mandelis, "Thermal‐wave resonator cavity," Review of scientific instruments, vol. 66, pp. 4999-5005, 1995.

指導教授

鍾德元(Te-yuan Chung)

審核日期

2013-8-29

推文