參考文獻 |
參考文獻
[1] M. Swaminathan, J. Kim, I. Novak, and J. P. Libous, “Power distribution networks for system-on-package: status and challenges,” IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 286–300, May 2004.
[2] T.-L. Wu, H.-H. Chuang, and T.-K. Wang, “Overview of power integrity solutions on package and PCB: decoupling and EBG isolation,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 346–356, May 2010.
[3] C. R. Paul, “Effectiveness of multiple decoupling capacitors,” IEEE Trans. Electromagn. Compat., vol. 34, no. 2, pp. 130–133, May 1992.
[4] T. Hubing, J. Chen, J. Drewniak, T. Van Doren, Y. Ren, J. Fan, and R. DuBroff, “Power bus noise reduction using power islands in printed circuit board designs,” International Symposium on Electromagnetic Compatibility, 1999, pp.1–4.
[5] Juan Chen, T.H. Hubing, T.P. Van Doren, and R.E. DuBroff, “Power bus isolation using power islands in printed circuit boards,” IEEE Trans. Electromagn. Compat., vol. 44, no. 2, pp. 373–380, May 2002.
[6] J. Choi, V. Govind, and M. Swaminathan, “A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications,” in Proc. IEEE Radio Wireless Conf., Atlanta, GA, Sept. 2004, pp. 243–246.
[7] T.-L. Wu, Y.-H. Lin, and S.-T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures,” IEEE Microw. Wireless Compon. Lett., vol. 14, no. 7, pp. 337–339, Jul. 2004.
[8] T. H. Kim, D. Chung, E. Engin, W. Yun, Y. Toyota, and M. Swaminathan, “A novel synthesis method for designing electromagnetic band gap (EBG) structures in packaged mixed signal systems,” in Proc. Electro. Compon. Techno.l Conf., San Diego, CA, May 2, 2006, pp.1645–1651.
[9] J.-H. Kwon, D.-U. Sim, S.-I. Kwak, and J.-G. Yook, “Novel electromagnetic bandgap array structure on power distribution network for suppressing simultaneous switching noise and minimizing effects on high-speed signals,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 365–372, May 2010.
[10] R. Abhari and G.V. Eleftheriades, “Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure,” in IEEE MTT-S Int. Microwave Symp. Dig., Seattle, WA, Jun. 2–7, 2002. pp. 493–496.
[11] R. Abhari and G.V. Eleftheriades, “Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits,” IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629–1639, Jun. 2003.
[12] T. Kamgaing and O. M. Ramahi, “A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,” IEEE Microw. Wireless Compon. Lett., vol. 13, no. 1, pp. 21–23, Jan. 2003.
[13] S.D. Rogers, “Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes,” IEEE Trans. Microw. Theory Tech., vol. 53, no. 8, pp. 2495–2505, Aug. 2005.
[14] J. Lee, H. Kim, and J. Kim, “High dielectric constant thin film SSN power/ground network for broad-band suppression of SSN and radiated emissions,” IEEE Microw. Wireless Compon. Lett., vol. 15, no. 8, pp. 505–507, Aug. 2005.
[15] C.-L. Wang, G.-H. Shiue, W.-D. Guo, and R.-B. Wu, “A systematic design to suppress wideband ground bounce noise in high-speed circuits by electromagnetic- bandgap-enhanced split powers,” IEEE Trans. Microw. Theory Tech., vol. 54, no. 12, pp. 4209–4217, Dec. 2006.
[16] C.-D. Wang, Y.-M. Yu, F. D. Paulis, A. C. Scogna, A. Orlandi, Y.-P. Chiou, and T.-L. Wu, “Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes,” IEEE Trans. Compon., Packag Manuf. Technol, vol. 2, no. 2, pp. 332–341, Feb. 2012.
[17] C. Caloz, and T. Itoh, Electromagnetic Metamaterials Transmission Line Theory and Microwave Applications, John Wiley, Nov. 2005.
[18] J.-S. G. Hong and M. J. Lancaster, Microstrip Filters for RF/Microwave Applications, John Wiley & Sons, Inc., 2001
[19] L.D. Smith, R.E. Anderson, D.W. Forehand, T.J. Pelc, and T. Roy, “Power distribution system design methodology and capacitor selection for modern CMOS technology,” IEEE Trans. Adv. Packag., vol. 22, no. 3, pp.284–291, Aug 1999.
[20] D. M. Pozar, Microwave Engineering, 3rd ed., John Wiley & Sons, Inc., 2005. |