| dc.description.abstract | The optoelectronic device with the trending minimization of application, often affect the electrical properties on thermal drift or breakdown device by thermal stress, it is required the compound silicone with thermal conductive components to transfer heat and to assist heat from the device, that consider simultaneously the electrically insulating or install with flexibility on mechanism, thereby simplifying the production process also improves the reliability of the product.
Different proportions of the compound silicone has a different thermal resistance RM and thermal conductivity kM, this research paper, in accordance with 1 ~ 4μm particle size and 120 ~ 150[W/m℃] thermal conductivity value range, to selecting the Graphite, Silicon carbide (SiC) and Aluminum nitride (AlN) that three additive materials is common in market, which the black graphite and silicon carbide is a conductor, aluminum nitride is an insulator.
Compound silicone were measured by using standard ASTM D5470, it must take more than two hours to steady state heat, then get the correct measured value of RM and kM , Derived formula of RM and kM with heat transfer theory and the principles of derived heat volume for calculate the theoretical value to comparing measured value.
Then can be available the maximum ΔRM is 0.20 [℃/W], the smallest tolerance is 0.01 [℃/W] ,while the maximum tolerance ΔkM is 0.11[W/(m∙℃)], the minimum tolerance is 0.01[W/(m∙℃)], that can be proved which the theoretical formula have useful reference in academic, and this can provide a quick calculation to predict heat transfer characteristics of the compound silicone in the relevant industry.
The conclusion that physical properties of the thermal conductive compound silicone: kM is no significant effect changes within mixing less than 30wt% conductive material as Graphite or SiC, then proportional increase kM until adding conductive material more than 40wt%, this is superior to AlN until more than each 68wt% mixing ratio. But the mechanical strength of the compound silicone is fragile when more than 85wt% mixing ratio. The RM of more than 75wt% AlN compound silicone less than the same ratio of SiC is good thermal conductivity. The 80wt% AlN compound silicone is better transferable heat and kM = 0.85. | en_US |