| dc.description.abstract | ABSTRACT
In this study, a Copper-Nickel alloy microcolumn and micro-spiral were prepared by continuous image electroplating in a citrate plating bath. During the experiment, the gap was fix at 40 μm, the control voltage was between 4.0 V and 4.3 V; or the voltage was fixed at 4.2 V, and the gap was changed between 40 μm and 55 μm. The result showed: when the gap was at 40 μm and the voltage is 4.2 V, the morphology of the microcolumn is smoother and denser. When the voltage was fixed at 4.2 V and the gap was increased from 40 μm to 55 μm, the surface of the microcolumn was roughened and the compactness of the structure was poor. When the voltage was fixed 4.2 V and the gap was at 40 μm, the concentration of saccharin was increased from 0 mM to 6.60 mM. The results showed: the surface of the microcolumn obtained by adding 2.20 mM saccharin is smooth and crack-free. The cross section of the microcolumn observed by SEM and EDX shows that the solid structure was crack-free, and the copper and nickel elements contained in the cross section showed uniform distribution.
In the nanoindentation test, it was found that when the voltage was changed, the hardness of the microcolumn decreased with the voltage rising to 4.3 V (3.56 GPa); when the gap was increased to 55 μm. The hardness of the microcolumn was increased to 4.86 GPa. When the concentration of saccharin in the plating bath was 2.20 mM, the hardness of the microcolumn reached the maximum of 5.13 GPa. The corrosion resistance of the Copper-Nickel alloy microcolumn was measured, and the microcolumn obtained at the concentration of saccharin at 2.20 mM had a minimum corrosion current density of 6.902*10-6 A/cm2.
According to the optimal plating conditions for the microcolumns, and cooperated with the Comsol software to study the analysis of the spiral diameter to the electric field, which contributed to the electroplating conditions for the fabrication of Copper-Nickel alloy micro spirals. The research results showed that when the plating angle was over 50°, the wire diameter variation could be controlled within 20%. And the minimum wire diameter change can be achieved when the process parameter is 3. | en_US |