| dc.description.abstract | Global semiconductor industry is highly competitive, but it is also Taiwan’s most competitive industry with a long-term growth perspective. The semiconductor industry’s contribution to Taiwan is irreplaceable. S Company an integrated device manufacturer (IDM) and its services range from wafer design, manufacturing, packaging, testing, and sales.
The Manufacturing Execution System is an important system for S Company, from upstream vendors to wafers to factories, shipping semiconductor wafers to customers, and documenting every detailed step in the packaging and testing process. Complete records of operators, machines, methods, materials and tooling are maintained in the MES system. Rework is an important issue in the factories, but S Company did not integrate this process into the MES system. S Company’s MES system has four main subsystems, and the wafer bumping subsystem is the first trial run subsystem of the MES.
This study aims to conduct a case study on S Company. The major objective of this study is to explore five aspects of the implementation process to customize MES for rework, including 1) the objective of the project, 2) the organization of the project, 3) the implementation steps of the project, 4) the manufacturing process, 5) the rework process, and how the five aspects affect the information technology system modules. Moreover, the study is going to provide the analysis on the reworked product quality improvement and the benefits of the manufacturing process management after integrating the rework process in MES system. | en_US |