博碩士論文 106323006 完整後設資料紀錄

DC 欄位 語言
DC.contributor機械工程學系zh_TW
DC.creator孟令軒zh_TW
DC.creatorLing-Xuan Mengen_US
dc.date.accessioned2020-1-14T07:39:07Z
dc.date.available2020-1-14T07:39:07Z
dc.date.issued2020
dc.identifier.urihttp://ir.lib.ncu.edu.tw:444/thesis/view_etd.asp?URN=106323006
dc.contributor.department機械工程學系zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract本研究提出離散元素法( Discrete Element Method, DEM )顆粒體微觀熱傳與力學理論,為了驗證顆粒體微觀熱傳與力學理論,本研究建立八個基準測試,確認離散元素模型的合理性與正確性,並作為開發3D列印離散元素模型的基礎。八個基準測試分別為:(1)兩端固定桿件的受熱應力分析;(2)無邊界束制彈性立方體受熱分析;(3)具邊界束制彈性立方體受熱應力分析;(4)半無限垂直圓柱試體的受熱分析;(5)矩形柱體承受兩端溫差的受熱分析;(6)含半圓形孔平板試體的受熱穩態應力分析;(7)含半圓形孔平板試體的受熱暫態應力分析;(8)顆粒排列方式對熱傳效應的影響。經由八個基準測試得知離散元素模擬結果與現有連續體理論解析解及有限元素法數值解相當吻合,證明了顆粒體熱傳理論、接觸鍵接理論及顆粒應力張量理論的合理性與正確性,並連接了微觀與巨觀理論的一致性。研究顯示配位數越大與粒子體積佔有率越高,其熱傳導性越佳,不同的結晶結構熱傳導性排序為:六方緊密堆積(HCP) ≒ 面心立方(FCC) 體心立方(BCC) ≒ 隨機排列(Random) 簡單立方(SC)。本研究提出的顆粒體熱傳理論尚未考量顆粒接觸面積的影響,在未來應納入顆粒接觸面積的因素。zh_TW
dc.description.abstractThis study investigates mechanical and thermal behaviours of granular assemblies by using discrete element modelling (DEM). To verify the proposed model of granule heat transfer, eight benchmark tests were established as follows:(1) a rectangular prism with fixed ends subjected to sudden temperature increases;(2) an isotropic and elastic cube with free boundary subject to sudden temperature changes;(3) an isotropic and elastic cube with boundary constraints subject to sudden temperature changes;(4) Semi-infinite vertical isotropic cylinder given the initial lower temperature and subjected to a fixed higher temperature at the top;(5) a rectangular body with simple cubic (SC) structure with free boundary, given the initial lower temperature and subjected to a fixed higher temperature at the left side;(6) Steady-state analysis of a plate with a semi-circular hole with boundary constraints, subjected to sudden temperature increases;(7) Transient analysis of a plate with a semi-circular hole with boundary constraints, subjected to sudden temperature increases;(8) a rectangular body formed of different crystal structures, given the initial lower temperature and subjected to a fixed higher temperature at the left side. The study shows that the DEM results match very well with the FEM and analytical solutions of continuum theory, which proves the rationality of the granule heat transfer, the bonding theory and the particle stress formula. The results also show that the heat conductivity of the face-centered cubic (FCC) structure is very close to that of the hexagonal closest packed (HCP) structure, and the heat conductivities of the body-centered cubic (BCC) structure and the random packing (RP) structure are very close. The heat conductivity follows the sequence : FCC ≒ HCP > BCC ≒ RP > SC.en_US
DC.subject離散元素電腦模擬zh_TW
DC.subject顆粒體熱傳理論zh_TW
DC.subject顆粒體力學理論zh_TW
DC.subject電腦模擬驗證研究zh_TW
DC.subject顆粒結晶結構zh_TW
DC.subjectDiscrete element simulationen_US
DC.subjectGranule heat transferen_US
DC.subjectGranular mechanicsen_US
DC.subjectsimulation verificationen_US
DC.subjectPacking structureen_US
DC.title顆粒體微觀熱傳與力學理論的基準測試zh_TW
dc.language.isozh-TWzh-TW
DC.titlenonoen_US
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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