dc.description.abstract | The thesis focuses on the method of using CMOS standard processes to the application of new MEMS (Microelectromechanical Systems) sensors. Due to the MEMS sensors suffer dramatic residual stresses in processes and viscous effect in etching procedures, wafer manufacturers always offer the MEMS processes as customized processes to reduce the effects from the mentioned issues. Thus, a new MEMS sensors manufactured using CMOS standard processes was elucidated in this thesis. By combining the mechanical structures of parasitoid fly Ormia ochracea and cloverleaf stem, the proposed MEMS structure can not only reinforce the sensitivity and the amplitudes of sensors, but also have high resistance to the effects from the residual stresses in the duration of CMOS processes. Furthermore, due to the vibrating membrane of the sensors were manufactured with multi-metal layers, the sensor membrane suffers significant deformations under the effects of residual stresses, so we used the simulation tool, CoventorWare, to investigate the out-of-plane deformations applied by the residual stresses and study how the viscous effects influence the sensor structure with ultra-high aspect ratio. Eventually, we use the simulation results to be as the guideline of the sensor design using the CMOS standard processes. In the rest part, we also provide a guideline for mass products using the CMOS standard processed, which includes a suitable post-etching recipe for the MEMS sensors in CMOS processes and the corresponding customized baking procedures. In final, the performance of the MEMS sensors was validated using laser Doppler experiments and a corresponding read-out circuit. The experimental results demonstrated that the proposed MEMS sensors can have -38 dBV/Pa SPL in the frequency spectra from 1 to 16KHz, which in similar to the human ear functions, and further the application region can be extended to 55KHz. Therefore, it is our belief that the proposed post-CMOS-like processes open an avenue that we might realize MEMS sensors by employing CMOS standard processes. | en_US |