dc.description.abstract | This paper is divided into four Chapter. Chapter 1 introduces the background and motivation of studying millimeter-wave packaging, followed by the types and applications of packaging, and finally the methods and objectives of studying millimeter-wave packaging.
In Chapter 2, we refer to many related papers, most of them use the π-model to build the equivalent circuit model of the flip-chip interconnection, and the component values in the circuit are calculated by curve fitting for the physical dimensions. This common method still has the limitation that when the structural parameters are different, the function is not selected properly, and then the component value is not physically meaningful. We re-analyze how to build the T-model of flip-chip interconnection in the millimeter-wave and how to extract the physically meaningful component values effectively, and then compare the differences of the scattering parameters with the full-wave simulation and practical measurements.
In Chapter 3, A simple calibration method is proposed and demonstrated by using MATLAB code. The formulae in the references are used, and then the calculation is simplified based on circuit characteristics. In the calibration method, signal flow is represented as a transmission matrix by using the principle of calculation flow. In a back-to-back series structure, the left half-circuit (or the right half-circuit) has a feeding structure on the left and right ends, and we can use the code proposing in MATLAB to calculate the contribution of the feeding structure to the circuit by de-embedding the feeding structure on both ends, and then derive the response of the solder bump and the conductor connected to it.
In Chapter 4, it outlines the fabrication of the flip-chip interconnection structure, and the fabricated version is divided into 10 GHz version and 40 GHz version according to the upper limit of the measured frequency. Firstly, the reasoning for making the two versions of the circuit was explained, and then we present the analysis and design of the structure parameters for the two implementations, and use the calibration method in Chapter 3 to calibrate the 40 GHz version, while the 10 GHz version is not calibrated due to its practical implementation. Finally, the scattering parameters of the theoretical calculation (ADS), the full-wave simulation (HFSS), and the practical measurements are verified by overlaying them with each other.
In Chapter 5, concludes the previous four chapters and describes the difficulties encountered during the implementation of the 10 GHz version and considers how to improve it in the future, while the 40 GHz version has a small discrepancy between the measurement results and the full-wave simulation, and this chapter summarizes the problems and considers possible solutions for future work. | en_US |