| dc.description.abstract | To address the issue of back side chipping during Saw-Dicing due to vibration, this study employed Bluetooth chip sensors to first collect data on the vibration sources. Subsequently, the main sources of vibration fluctuations were determined through the analysis of vibration values. Then, through a Plan-Do-Check-Act (PDCA) approach, the study focused on the vibration sources, listing and analyzing various factors influencing vibration, including different water flow rates, Total Thickness Variation (TTV) of flange surfaces, and the selection of blade types. Experiments were conducted under these conditions to compare the extent of backside chipping under different processing conditions and identify the primary sources of vibration.
The experimental results showed that:
When only the water flow rate was changed under the same conditions, the chip fracture depth within the acceptable tolerance ratio for water flow rates of 2.0L/min and 1.5L/min was 0.2206% and 0.2352%, respectively, with a fracture depth ratio of approximately 1:1.066. The vibration curves indicated that these two were quite close.
When only the types of diamond blades (SD#3000 and SD#4500) were changed under the same conditions, the chip fracture depth within the acceptable tolerance ratio was 0.2026% and 0.2113%, respectively, with a fracture depth ratio of approximately 1:1.043. The vibration curves indicated that these two were also quite close.
When only the flatness of the new and old flanges was changed under the same conditions, the chip fracture depth within the acceptable tolerance ratio was 0.0340% and 0.6267%, respectively, with a fracture depth ratio of approximately 1:18. The vibration curves indicated a significant difference between the two.
From the experimental results, it can be observed that the ratio of fracture depth to flatness is 1:18, which is much greater than the ratios for changing water flow (1:1.043) and different diamond blades (1:1.066). It is evident that the flatness of the flange surface is the primary source affecting vibration. Through the measurement of abnormal and normal fracture depth ratios obtained by vibration chip sensors, with a chip cutting width of 0.1mm allowing for fracture tolerance below 10µm, this study confirms that when the vibration intensity is less than 2.5, the standard for fracture tolerance below 10µm can be achieved, and the yield can reach 100% | en_US |