dc.description.abstract | The fiber optical transceiver is an important electronic device in the communication system. Currently, it is evolving towards high power and miniaturized packaging. For the development of large-scale systems, the simplified model can effectively reduce computational resources and time.
In this study, we focused on the quad small form-factor pluggable (QSFP) optical transceiver, which has five heat sources and a total power dissipation of 25 Watts. We applied the concept of DEvelopment of Libraries of PHysical models for an Integrated design environment (DELPHI) methodology to develop a compact thermal model with boundary condition independence. Different thermal resistance network topologies were constructed for the optical transceiver. Using the Taguchi method, appropriate sets of boundary conditions were designed. The commercial software Simcenter FloTHERM was then used to create a computational fluid dynamics model for the optical transceiver, which provided the thermal data for optimizing the compact thermal model. Finally, the optimization process of the compact thermal model was implemented using MATLAB to find the optimal thermal resistances.
Among the different network topologies of the compact thermal models used in this study, each model exhibits good predictive accuracy and boundary condition independence. The average relative error in predicting heat source temperatures is within 2%, and the average relative error in predicting wall heat flux is within 8%. The advanced double shunted network compact thermal model has the best predictive capability, which indicates that improving the network topology can effectively enhance the predictive accuracy of the compact thermal model. When applying the compact thermal model to the computational fluid dynamics software FloTHERM for simulating realistic environments, the average relative error in predicting heat source temperatures is around 6%, and the average relative error in predicting wall heat flux is around 10%. The maximum relative error exceeds 20%. This indicates that there is still room for improvement in the developed compact thermal model in this study.
In the future, if the compact thermal model of the optical transceiver is to be applied in system-level thermal analysis, it is necessary to minimize the predictive errors of the compact thermal model. This will enable more accurate simulation of the thermal behavior of the optical transceiver. | en_US |