| dc.description.abstract | In the post-epidemic era, the trade competition between the United States and China, the semiconductor industry has formed a situation of clear barriers by geopolitics. The policies of the semiconductor industry in many countries has been changed, from global division manufacturing to start to actively develop the semiconductor industry by themselves. 5G, AI and high-performance computing technologies continue to progress, and smart industries such as smart healthcare, smart cities, and smart agriculture are all accelerating development, increasing the demand ICs come with huge increases in various industries, and provide multi-function development of global semiconductors. And since Taiwanese manufacturers have a complete supply chain of semiconductors, we become the most popular partners now.
In a strong competitive environment of the world, and the IC packaging and testing industry needs to strictly control the product and development cycle to strive for market opportunities. Therefore, quickly and efficiently selecting the right suppliers so that all materials can be delivered in a time has become an important issue in supplier management. The IC packaging and testing industry is responsible for cutting the entire processed wafer into single grains, then molded with resin, plastic, ceramics, and other materials to protect the grains from contamination. Among the categories of material used, packaging materials are a lower proportion of the cost and have a larger volume than other materials. But if there is a shortage of packaging materials, even if the IC processing is completed, it cannot be delivered to the customer as scheduled. The packaging material industry is complex, and there are many potential suppliers, which makes it more difficult to supplier selection. The establishment of a reliable packaging material supplier evaluation mechanism in the IC packaging industry can help enterprises select suitable packaging material suppliers more efficiently.
The Analytic Hierarchy Process was used in this study, aiming at the ＂ selection of packaging material suppliers ＂ problem in the IC packaging and testing industry, and evaluating and discussing the weight of the selected indicators. First, refer to the criteria and attributes of historical documents, interview experts and integrate expert opinions, and establish a supplier selection mechanism for packaging materials. Then summarize the weight value between the criteria and attributes, which will be used as the basis for the future decision-making of the IC packaging and testing industry in the selection of suppliers of packaging materials. | en_US |