| dc.description.abstract | In the semiconductor industry, mold flow analysis is crucial for simulating IC packaging to ensure smooth processes. Before analysis, CAD models are converted into solid meshes, making meshes the essential first step in the analysis process. The results of mold flow analysis are influenced by various parameter settings, and the type of mesh also contributes to differences in the analysis results. Different mesh structures result in variations in mesh quality, thus impacting the accuracy of the mold flow analysis results. With advancing IC packaging technology, CAD models become more complex, increasing mesh count and analysis time. This study aims to explore how different mesh types affect mold flow analysis results, using various IC CAD models, and comparing single and multiple spacing methods. Firstly, construct BLM, hybrid HEXA, and fully quadrilateral surface mesh generated by the MC algorithm for various models. And compare the quality of each type of mesh. Subsequently, each model was subjected to mold flow analysis under identical material and parameters to observe differences in analysis results among different mesh types. Based on the analysis results, this study concluded that BLM exhibited significant differences in flow front trends compared to other mesh types due to structural variations. Additionally, BLM produced higher values in temperature and pressure results. The multiple spacing distribution was impacted by differences in mesh sizes between the inner and outer circles of the model, resulting in slower plastic flow through the inner circle compared to the outer circle. | en_US |