博碩士論文 89541011 完整後設資料紀錄

DC 欄位 語言
DC.contributor電機工程學系zh_TW
DC.creator胡明智zh_TW
DC.creatorMing-Jyh Hwuen_US
dc.date.accessioned2004-10-1T07:39:07Z
dc.date.available2004-10-1T07:39:07Z
dc.date.issued2004
dc.identifier.urihttp://ir.lib.ncu.edu.tw:444/thesis/view_etd.asp?URN=89541011
dc.contributor.department電機工程學系zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract摘 要 通道摻雜異質接面場效應電晶體具有高電流推動能力,以及元件功率特性及效能。由於此高電流推動能力及熱穩定性,因此廣泛地應用在微波功率元件及高速元件上。 然而閘極漏電流經常限制了通道摻雜異質接面場效應電晶體元件的功率特性,由其在高輸入功率時。先我們利用鐠金屬來加入鈦/金金屬閘極的製作,來改良元件之閘極漏電流,進而改善整體元件功率特性及效能。 為了要大幅度增加功率元件的崩潰特性,多數製程採用雙重曝光暨雙重閘極蝕刻來改善元件崩潰電壓之特性,我們利用電子束微影設備來開發單次直寫微影技術配合乾蝕刻及溼蝕刻的雙重掘入技術來改善銦砷化磷-銦砷化鎵通道摻雜場效應電晶體的輸出功率特性。 最後,我們利用埋入式鉑金屬技術來製作增強及空乏型深次微米T型閘極異質結構鋁砷化鎵-銦砷化鎵電晶體,進行一系列元件直流,高頻,以及功率方面之研究。接著我們完成增強及空乏型反相器及差動式放大器電路。zh_TW
dc.description.abstractABSTRACT Doped-channel heterostructure field-effect transistors (DCFETs) with a high current density and superior microwave power performance was developed and characterized. Due to its excellent current driving capability and thermal stability, it has been widely investigated for microwave power devices and high-speed devices. However, gate leakage current always limits the power performance of DCFETs devices especially under a high input power swing. We interested in improving the Schottky gate performance by inserting a thin praseodymium (Pr) metal layer on the bottom of conventional Ti/Au gate in AlGaAs/InGaAs DCFET fabrication. We suppress the gate leakage current and enhance microwave power performance by Pr metal gate deposition. In chapter 3, we use the single exposure e-beam direct writing method plus the selective wet and dry etchings to fabricate double-recessed DCFETs (DR-DCFETs) and to improve device power performance. The 0.2 µm gate length InGaP/InGaAs DR-DCFET was developed and characterized. In chapter 4, we fabricated enhancement/depletion-mode AlGaAs/InGaAs sub-micron T-shape gate HEMTs by buried-Pt technique. The 0.2 µm gate length E-mode and D-mode AlGaAs/InGaAs HEMTs were developed and characterized. The dc, rf, and microwave power performance of the device will be presented. Furthermore, the E/D-Mode circuit was demonstrated, including inverter and differential amplifier.en_US
DC.subject場效應電晶體zh_TW
DC.subject電子束微影技術zh_TW
DC.subjectField-Effect Transistorsen_US
DC.subjectElectron Beam Lithographyen_US
DC.title電子束微影技術於深次微米異質 結構場效應電晶體元件之應用zh_TW
dc.language.isozh-TWzh-TW
DC.titleElectron Beam Lithography Technology for the Application of Deep Sub-micron Heterostructure Field-Effect Transistors en_US
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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