博碩士論文 92323031 完整後設資料紀錄

DC 欄位 語言
DC.contributor機械工程學系zh_TW
DC.creator盧致宏zh_TW
DC.creatorZhi-Hong Luen_US
dc.date.accessioned2006-7-18T07:39:07Z
dc.date.available2006-7-18T07:39:07Z
dc.date.issued2006
dc.identifier.urihttp://ir.lib.ncu.edu.tw:444/thesis/view_etd.asp?URN=92323031
dc.contributor.department機械工程學系zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract摘 要   電化學放電加工多用於進行玻璃等非導電體的加工,加工出來的微孔雖然有良好的表面品質,但是因為入出口的擴孔,使得孔壁準直度極差。本實驗使用階級式的電極對電化學放電加工後的微孔進行機械式的研磨,並利用電泳吸附沉積研磨來改善其表面粗糙度。   經過實驗結果的觀察與比較,發現階級式電極的機械式研磨可有效將孔洞形狀研磨至幾乎完全準直,但是加工後的表面粗糙度過大;而再利用電泳沉積研磨來加工,可有效改善其表面粗糙度,且不會對孔壁準直度產生明顯影響。比較各項研磨參數的影響後,發現研磨時間越長、轉速越高均可得到越好的表面,但是真圓度、孔徑差及擴孔量均會增加。使用粒徑0.3µm的研磨液,最佳可得到平均粗糙度5nm的良好表面。zh_TW
dc.description.abstractAbstract Electrochemical Discharge Machining(ECDM) are usually applied in machining of non-conductor material such as glass. The micro-hole machined by ECDM can obtain good surface roughness, but the shape is poor because of the enlargement of entrance and exit. In this paper, we use stepped electrode to grind the micro-hole mechanically after ECDM, and use electrophoresis deposition grinding(EPDG) to improve the surface roughness. According to the results of experiment, mechanical grinding with stepped electrode can make the shape of micro-hole almost totally straight, but the surface roughness is poor. Using EPDG after mechanical grind can get excellent surface roughness without changing the straightness obviously. Compare to the influences of different parameters, we found that the longer grinding time and higher rotational speed can get better surface roughness, but worse roundness, enlargement and the difference between hole diameter of entrance and exit. The best surface average roughness is 5 nm when the abrasive size of slurry is 0.3 µm.en_US
DC.subject玻璃zh_TW
DC.subject電化學放電加工zh_TW
DC.subject電泳zh_TW
DC.subject研磨zh_TW
DC.subjectECDMen_US
DC.subjectEPDen_US
DC.subjectgrindingen_US
DC.subjectglassen_US
DC.title電化學放電加工對玻璃微孔品質的改善zh_TW
dc.language.isozh-TWzh-TW
DC.titleStudy of Quality Improvement of Glass Micro-holes by ECDMen_US
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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