dc.description.abstract | With the increasing of the number of processors and the operational speed, electronic interconnect suffers attenuation, cross talk, power consumption, with degrades the performance of high speed transmission systems. Optical interconnects, on the contrary, are being considered to replace electrical interconnects due to their high bandwidth capacity, immunity to electromagnetic interference, low cost and sufficiently light weight. Polymer waveguides are attractive candidates as optical interconnect media since their capability to enable low-cost and high-density interconnects, and can be easily integrated into current organic board-level processes.
EpoCoreTM and EpoCladTM are chemically strengthened photoresists based on multifunctional oligomers containing epoxy groups. Using EpoCore as core material and EpoClad as cladding, thermally stable optical waveguides are fabricated, via standard circuit board fabrication technology.
The average propagation loss of the waveguide is estimated to be 0.45dB/cm; at wavelength of λ=850nm. In order to access whether the waveguide can be made on the inner large of the PCB we simulate the propagation characteristics through the linkage from the VSCEL, 45 degree mirror, to the PD. Variousparamters such as the height of the VCSEL and PD,angle of the mirror,and surface roughness are all taken in to account.
It is concluded that the alignment tolerance can be made less stringent if the effective area of the PD can be made larger (0.2 mm x 0.2mm) and the Diverging angle of the VCSEL can be made smaller (8 degree).
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