| dc.description.abstract | Electrical discharge machining (EDM) has been developed for over half a century, and there have been numerous materials machined by means of this technology. However, little research is conducted on poly-silicon. The current study investigated the effects of operation parameters on feedrate, machining groove width, and surface roughness, utilizing the technology of WEDM to process poly-silicon, in hopes of having a breakthrough in the technology of WEDM on poly-silicon.
The results showed that the longer on-time or the larger the open-voltage was, the faster the feedrate was, the wider the machining groove width was, and the coarser the surface roughness was. The off-time suggested a contrast effect. Moreover, increasing the wire tension might modify the machining groove width, but might lower the feedrate, revealing a tendency of worsening the surface roughness. As for other factors causing effects on the manufacturing process, a larger flush flow rate, helped amend the feedrate, the machining groove width, and surface roughness while wire speed could only partially improve the feedrate, the machining groove width and had limited impact on the surface roughness.
The results from the second part of the experiment also indicated that processing poly-silicon by means of double-pulse power supply could actually modify the phenomenon of ignition delay and increase the discharge frequency, promoting the machining efficiency. The present study successfully showed that WEDM can be applied to poly-silicon wafers slicing. This manufacturing process is believed to be competitive if used in industries related to solar cell.
| en_US |